Our many products are applied to numerous applications. For example, our:
- solders are used for mechanical joining, electronics manufacturing, semiconductor device assembly, and more.
- alloying expertise finds use in applications ranging from thermal management to thin-film technology to fusible devices.
- inorganic compounds are critical ingredients in dry cell batteries, are precursors in the LED MOCVD process, and are used to optimize fiber optic devices, to name a few.
Explore these common applications of our many products, then contact us to tell us how we can work for you.
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Indium Corporation Blog Posts
Patty was walking to her office as she saw Professor Ulf Gabrielson pass by. What an impressive older gent she thought. He had been a contender for ...
The Professor leads an informative discussion on the future of portable electronics.
In a previous blog I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram. This tool helps map out a process and provide an excellent visual aid that helps show the potential defect causes and the effects the process variables can have. This particular Ishikawa Diagram displayed that reflow profile can have a large effect on voiding. Today I will dig into this area a bit further and talk about how we can minimize large ground plane solder voiding in electronic assemblywith differences in reflow profile.
Product Manager for Engineered Solders Materials
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.