Technical Solution Center
Please select your industry challenge, along with your application area:
Don't see your challenge or application area? Contact Us
Search our technical articles:
Current News
Indium Corporation Expert to Present at IMPACT-EMAP
November 23, 2021
Durafuse™ LT Indium Corporation's award-winning low-temperature alloy technology, will be the f…
Latest Blog Post
Tin Whiskers 101: Part 2: What Causes Them
October 31, 2021
Folks,
Continuing our series on tin whiskers. In the last post we discussed what they are. in this …
Newest Tech Paper
Reinforced Solder Preforms for High-Reliability and Low-Voiding (SC)
焊料由于其多种特性而成为一种卓越材料。以一个相对低的熔点，焊料能够将两个高熔点物体表面（如铜）焊接在一起。而且，这种键合具有极高的导电性和导热性。这些与众不同的属性使焊料成为电子组装行业将元器件结合到…