Related High Temp Technical Papers
Application Notes
- Gold-Tin The Unique Eutectic Solder Alloy (US Letter)
High-Temperature Soldering & Brazing
Indium Corporation offers high-performance soldering materials for power semiconductors and other applications in harsh environment.
Related High Temp Blog Articles
Size Does Matter!
How solder powder size can effect solder paste performance.
Read MoreWhy Do We Need to Go Thinner?
Indium Corporation has developed a thinner gold preform for high-output lasers, therefore improving the thermal transfer and operational efficiency of high-output lasers by reducing voiding, solder volume, and wicking up the die.
Read More2020 SPIE Photonics West Show
Come see Indium Corporation's new AuLTRA™ ThInFORMS™ at SPIE West in San Francisco, CA Feb. 4-6, 2020. AuLTRA™ ThInFORMS™ improve thermal transfer and the overall operational efficiency of die-attach applications.
Read MoreFeatures & Benefits
Indium Corporation is a leading joining and bonding materials innovator for medical, aerospace, optoelectronics, and automotive applications. When even 10 ppm of contamination can cause process and application failures – quality counts. Indium Corporation casts our alloys, which enables us to closely control the process from start to finish and ensure purity.With over 200 alloys available, we have alloy solutions for temperatures up to 1,100°C.
High Temperature Products
Lead-free options from Indium Corporation
Gold Solders
Gold based alloys offer strong bond strength, excellent corrosion and oxidation resistance, and good thermal and electrical transfer at the braze joint.
Sintering Products
Indium Corporation’s QuickSinter™ silver sintering pastes are high metal-loading materials designed to fit easily into a dispense process with no change of deposition equipment. The pastes can also use fast “reflow-like” (RFL) sintering processes to form strong joints on many standard leadframe, DBC, and IPM pad finishes, and will bond strongly to die with Ag, Au, or Cu surfaces.
Silver-Based High Temp Alloys
High thermal and electrical conductivity, capillaries very well into joints, and holds up well in applications with lots of stress and with CTE mismatches.
| Attributes | Alloys | Temperature | |
|---|---|---|---|
| Gold-Based Alloys | Strong bond strength, excellent corrosion and oxidation resistance, and good thermal and electrial transfer at the braze joint. | Indalloy®182 (80Au/20Sn) Indalloy®183 (88Au/12Ge) Indalloy®178 (82Au/18In) Indalloy®195 (80Au/20Cu) Braze Indalloy®B955 (50Au/50Cu) Braze Indalloy®B9902 (65Cu/35Au) Indalloy®200 (100Au) 96.8Au3.2Si used for die-attach Indalloy®270 (75Au/25Sn) Indalloy®269 (78Au/22Sn) Indalloy®271 (79Au/21Sn) |
280°C Eutectic 356°C Eutectic Solidus 451°C / Liquidus 485°C 891°C Eutectic Solidus 955°C / Liquidus 970°C Solidus 990°C / Liquidus 1010°C 1064°C Eutectic 363°C Eutectic Solidus 278°C / Liquidus 332°C Solidus 278°C / Liquidus 301°C Solidus 278°C / Liquidus 289°C |
| Silver-Based Alloys | High thermal and electrical conductivity, capillaries very well into joints, and holds up well in applications with lots of stress and with CTE mismatches. | Braze Indalloy®B625 (61.5Ag / 24Cu / 14.5In) Braze Indalloy®B6851 (63Ag / 27Cu / 10In) Indalloy®193 (72Ag / 28Cu) Braze Indalloy®B962 (99.99Ag) |
Solidus 625°C / Liquidus 705°C Solidus 685°C / Liquidus 730°C 780°C Eutectic 962°C Eutectic |
| Standard Materials | °C | |||||||
|---|---|---|---|---|---|---|---|---|
| Comments | Sn | Ag | Sb | Au | Bi | Ge | Solidus | Liquidus |
| Lower Tj IGBT usage | 96.5 | 3.5 | 221°C | Eutectic | ||||
| Also known as "J-alloy" | 65 | 25 | 10 | 233°C | Eutectic | |||
| Commonly used in step-soldering processes | 95 | 5 | 237°C | 240°C | ||||
| Highest Sb content possible in standard Sn/Sb wire | 91.5 | 8.5 | 241°C | 248°C | ||||
| Commonly used in step-soldering processes | 90 | 10 | 243°C | 257°C | ||||
| Highest melting standard Sn/Sb alloy | 86 | 14 | ||||||
| Very poor solder-ability | 11 | 89 | 262°C | 360°C | ||||
| Very high tensile strength and thermal / electrical conductivities | 20 | 80 | 280°C | Eutectic | ||||
| Usable for very high Tj die-attach such as SiC | 88 | 12 | 356°C | Eutectic | ||||
