High-Temperature Soldering & Brazing
Indium Corporation offers high-performance soldering materials for power semiconductors and other applications in harsh environment.
Related High Temp Videos
*The video content below was created before the COVID-19 pandemic and does not reflect the current safety protocols upheld by Indium Corporation.
Gold-Indium (AuIn) Alloys for High-Reliability Braze Solutions
6 Alloy Families: Gold
Avoid the Void®: Voiding in High-Temperature Soldering
Avoid the Void®: High-Temperature Soldering with Semiconductor-Grade Preforms
Related High Temp Blog Articles
When Life Gives You Lumens, Make LED Paste!
AuLTRA™ 3.2 and AuLTRA™ 5.1 are air or nitrogen reflow AuSn solder pastes specially formulated for higher processing temperatures and assembly needs required in high-power LED module array applications. These AuSn solder pastes offer consistent printing and reflow, in addition to exceptional wetting and low-voiding. AuLTRA™ 3.2 and AuLTRA™ 5.1 solder pastes are available in these alloy compositions: 80Au/20Sn, 79Au/21Sn, 78Au/22Sn, and 77Au/23Sn, and powder sizes 2 to 7SGS.
Read MoreSPIE Photonics West 2022
Indium Corporation to promote new specialty prodict offerings: AuLTRA™75, AuLTRA™ ThInFORMS™, and AuLTRA™ Fine Ribbon, at SPIE Photonics West in San Francisco, CA (January 22-27).
Read More2021 Space Tech Expo
Come see Indium Corporation's new AuLTRA™75, AuLTRA™ ThInFORMS™, and Thermal Interface Materials at the Space Tech Expo in Long Beach, CA Oct. 6-8, 2021.
Read More‘Aye, you,’ do you make jewelry?
While continuing to be a premier solder materials manufacturer and supplier, Indium Corporation now manufactures and supplies jewelry making materials. These materials are available in 99.99% gold grain, and pink, purple, and red colored gold.
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Indium Corporation's new off-eutectic alloy preforms ensure strong solder joints in a plethora of device and package hardware. Our off-eutectic AuSn preforms are currently available now in 79/21, 78/22, and 75/25 compositions, with a wide range of X, Y, and Z dimensions available.
Read MoreIndium Corporation is a leading gold and silver alloy bonding and brazing materials innovator for high-temperature and high-reliability applications, such as die-attach and hermetic sealing, in various industries including automotive, RF infrastructure, military, laser, and aerospace.
With over 200 alloys available, we have alloy solutions for temperatures up to 1,100°C. Providing an alternative to traditional high-lead options, Indium Corporation currently offers and is continuously developing novel lead-free solutions such as gold solders, sintering, preforms, and alloy technology with new flux systems
High Temperature Products
Lead-free options from Indium Corporation
Gold Solders
Gold based alloys offer strong bond strength, excellent corrosion and oxidation resistance, and good thermal and electrical transfer at the braze joint.
Sintering Products
Indium Corporation’s QuickSinter® silver sintering pastes are high metal-loading materials designed to fit easily into a dispense process with no change of deposition equipment. The pastes can also use fast “reflow-like” (RFL) sintering processes to form strong joints on many standard leadframe, DBC, and IPM pad finishes, and will bond strongly to die with Ag, Au, or Cu surfaces.
Silver-Based High Temp Alloys
High thermal and electrical conductivity, capillaries very well into joints, and holds up well in applications with lots of stress and with CTE mismatches.
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| Attributes | Alloys | Temperature | |
|---|---|---|---|
| Gold-Based Alloys | Strong bond strength, excellent corrosion and oxidation resistance, and good thermal and electrical transfer at the braze joint. | Indalloy®200 (100Au) Indalloy®178 (82Au/18In) (96.8Au3.2Si) Indalloy®183 (88Au/12Ge) Indalloy®270 (75Au/25Sn) Indalloy®269 (78Au/22Sn) Indalloy®271 (79Au/21Sn) Indalloy®182 (80Au/20Sn) |
1064°C Eutectic Solidus 451°C / Liquidus 485°C 363°C Eutectic 356°C Eutectic Solidus 278°C / Liquidus 332°C Solidus 278°C / Liquidus 301°C Solidus 278°C / Liquidus 289°C 280°C Eutectic |
| Silver-Based Alloys | High thermal and electrical conductivity, capillaries very well into joints, and holds up well in applications with lots of stress and with CTE mismatches. | Braze Indalloy®B962 (99.99Ag) Indalloy®193 (72Ag / 28Cu) Braze Indalloy®B6851 (63Ag / 27Cu / 10In) |
962°C Eutectic 780°C Eutectic Solidus 685°C / Liquidus 730°C |
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| Standard Materials | ||||||||
|---|---|---|---|---|---|---|---|---|
| Comments | Sn | Ag | Sb | Au | Bi | Ge | Solidus (°C) | Liquidus (°C) |
| Lower Tj IGBT usage | 96.5 | 3.5 | 221°C | Eutectic | ||||
| Also known as "J-alloy" | 65 | 25 | 10 | 233°C | Eutectic | |||
| Commonly used in step-soldering processes | 95 | 5 | 237°C | 240°C | ||||
| Highest Sb content possible in standard Sn/Sb wire | 91.5 | 8.5 | 241°C | 248°C | ||||
| Commonly used in step-soldering processes | 90 | 10 | 243°C | 257°C | ||||
| Highest melting standard Sn/Sb alloy | 86 | 14 | ||||||
| Very poor solder-ability | 11 | 89 | 262°C | 360°C | ||||
| Very high tensile strength and thermal / electrical conductivities | 20 | 80 | 280°C | Eutectic | ||||
| Usable for very high Tj die-attach such as SiC | 88 | 12 | 356°C | Eutectic | ||||
