Related High Temp Technical Papers
Application Notes
- Gold-Tin The Unique Eutectic Solder Alloy (US Letter)
High-Temperature Soldering & Brazing
Indium Corporation offers high-performance soldering materials for power semiconductors and other applications in harsh environment.
Related High Temp Blog Articles
What the Off-Eutectic?
Indium Corporation's new off-eutectic alloy preforms ensure strong solder joints in a plethora of device and package hardware. Our off-eutectic AuSn preforms are currently available now in 79/21, 78/22, and 75/25 compositions, with a wide range of X, Y, and Z dimensions available.
Read MoreIMS 2020 Virtual Show
The International Microwave Symposium (IMS) Live Stream Event (Aug 4-6) is the premier annual international meeting for technologists involved in all aspects of microwave theory and practice. It consists of a full week of events, including technical paper presentations, workshops, and tutorials, as well as numerous social events and networking opportunities.
Read MoreThat's a 'Fine' Ribbon You Got There!
Indium Corporation has developed 80Au20Sn < 0.1” wide fine-grade precision ribbon for high volume, fully automated laser diode assembly processes. Our high quality precision AuLTRA™ Fine Ribbon is designed for high volume production and is packaged on precision spools suitable for auto-feed systems.
Read MoreIndium Corporation is a leading gold and silver alloy bonding and brazing materials innovator for high-temperature and high-reliability applications, such as die-attach and hermetic sealing, in various industries including automotive, RF infrastructure, military, laser, and aerospace.
With over 200 alloys available, we have alloy solutions for temperatures up to 1,100°C. Providing an alternative to traditional high-lead options, Indium Corporation currently offers and is continuously developing novel lead-free solutions such as gold solders, sintering, preforms, and alloy technology with new flux systems
High Temperature Products
Lead-free options from Indium Corporation
Gold Solders
Gold based alloys offer strong bond strength, excellent corrosion and oxidation resistance, and good thermal and electrical transfer at the braze joint.
Sintering Products
Indium Corporation’s QuickSinter™ silver sintering pastes are high metal-loading materials designed to fit easily into a dispense process with no change of deposition equipment. The pastes can also use fast “reflow-like” (RFL) sintering processes to form strong joints on many standard leadframe, DBC, and IPM pad finishes, and will bond strongly to die with Ag, Au, or Cu surfaces.
Silver-Based High Temp Alloys
High thermal and electrical conductivity, capillaries very well into joints, and holds up well in applications with lots of stress and with CTE mismatches.
| Attributes | Alloys | Temperature | |
|---|---|---|---|
| Gold-Based Alloys | Strong bond strength, excellent corrosion and oxidation resistance, and good thermal and electrial transfer at the braze joint. | Indalloy®182 (80Au/20Sn) Indalloy®183 (88Au/12Ge) Indalloy®178 (82Au/18In) Indalloy®195 (80Au/20Cu) Braze Indalloy®B955 (50Au/50Cu) Braze Indalloy®B9902 (65Cu/35Au) Indalloy®200 (100Au) 96.8Au3.2Si used for die-attach Indalloy®270 (75Au/25Sn) Indalloy®269 (78Au/22Sn) Indalloy®271 (79Au/21Sn) |
280°C Eutectic 356°C Eutectic Solidus 451°C / Liquidus 485°C 891°C Eutectic Solidus 955°C / Liquidus 970°C Solidus 990°C / Liquidus 1010°C 1064°C Eutectic 363°C Eutectic Solidus 278°C / Liquidus 332°C Solidus 278°C / Liquidus 301°C Solidus 278°C / Liquidus 289°C |
| Silver-Based Alloys | High thermal and electrical conductivity, capillaries very well into joints, and holds up well in applications with lots of stress and with CTE mismatches. | Braze Indalloy®B625 (61.5Ag / 24Cu / 14.5In) Braze Indalloy®B6851 (63Ag / 27Cu / 10In) Indalloy®193 (72Ag / 28Cu) Braze Indalloy®B962 (99.99Ag) |
Solidus 625°C / Liquidus 705°C Solidus 685°C / Liquidus 730°C 780°C Eutectic 962°C Eutectic |
| Standard Materials | °C | |||||||
|---|---|---|---|---|---|---|---|---|
| Comments | Sn | Ag | Sb | Au | Bi | Ge | Solidus | Liquidus |
| Lower Tj IGBT usage | 96.5 | 3.5 | 221°C | Eutectic | ||||
| Also known as "J-alloy" | 65 | 25 | 10 | 233°C | Eutectic | |||
| Commonly used in step-soldering processes | 95 | 5 | 237°C | 240°C | ||||
| Highest Sb content possible in standard Sn/Sb wire | 91.5 | 8.5 | 241°C | 248°C | ||||
| Commonly used in step-soldering processes | 90 | 10 | 243°C | 257°C | ||||
| Highest melting standard Sn/Sb alloy | 86 | 14 | ||||||
| Very poor solder-ability | 11 | 89 | 262°C | 360°C | ||||
| Very high tensile strength and thermal / electrical conductivities | 20 | 80 | 280°C | Eutectic | ||||
| Usable for very high Tj die-attach such as SiC | 88 | 12 | 356°C | Eutectic | ||||
