High-Temperature Soldering

A little over a year ago, I posted about the increase in interest regarding Cu sintering. In the past 12 months, that interest has has surged, highlighting Cu sintering's suitability for various

Folks, I am working on a book with my Indium Corporation colleagues on tackling soldering defects in electronics.It is a follow up to our The Printed Circuits Assembler's Guide to Solder Defects.

“A key ingredient that is critical to the solder paste formulation is rosin, which plays a significant role in enhancing the performance of the solder paste and hence providing high process

Folks, Peter writes: Dear Dr. Ron, I amthrilled with your Excel® program to calculate IMC thickness as a function of time. However, I wanted to calculate IMC thickness for times not listed in the

Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle from the chip to the system—from IC design, wafer fab,

Folks, Let’s look in on Ivy University Professor Patty Coleman as she chats with John Archer about Walter Isaacson’s biography of Elon Musk. “I have to admit, reading about

Folks, I was reading BBC’s Science Focus Magazine when I came across a reader’s letter to the editor in the October issue on page 12: “Reading the Q&A about fusion power

Folks, In my last post, I discussed the concern for copper-tin intermetallic (IMC) growth in solder joints at high service temperatures. Since then, I have developed an Excel® spreadsheet that

Folks, The service temperature for electronics in a modern automobile can be higher than 125C. These high temperatures raise the concern of copper-tin intermetallic growth in solder joints. Often, we