Applications
Burn-In Test
The most stringent application requirements for thermal interface materials (TIMs) are found in semiconductor testing. This environment presents challenges such as increased power, elevated heat flux, larger die sizes, and greater warpage that must be effectively managed. For semiconductor testing, compressible soft metal alloys like indium have become the industry standard. Specifically engineered for burn-in and testing processes, these recyclable materials support multiple insertions, improve process yields, and offer ease of use.
Overview
Improve Process Yields With Heat-Spring® HSK
Heat-Spring® HSK features a textured pattern on one side and an aluminum-clad barrier layer on the other, ensuring durability through numerous insertions. The thin aluminum layer facing the device under test (DUT) prevents the soft metal from adhering to the surface, effectively reducing the risk of stains and cracks.
Benefits
Enhance Gap-Filling and Thermal Performance on Uneven Surfaces
Sustainable TIM
Metal TIMs are easy to handle, 100% recyclable, and eligible for credit upon return. Multiple alloys are available depending on operating temperature requirements.
Flexible
Adaptable formats can bend up to 90° and wrap around various test head/socket lid configurations, including gimbaled test heads.
Performance
Surface pattern designs reduce contact resistance, delivering thermal performance comparable to solder at 50 psi. New options for even lower pressure are also available.
Multiple Insertions
The aluminum-clad layer on the DUT prevents staining and sticking, allowing it to be used for hundreds of cycles.
Burn-in & Test Products
All of our thermal interface materials are metal-based, which means they have a very high conductivity compared to polymer-based thermal interface materials.
Heat-Spring®
A renowned soft metal alloy thermal interface…
Phase Change Metal TIMs
Discover the advantages of PCMA TIMs over…
Solder TIMs
Solder TIM solutions offer superior reliability and…
Indalloy®301LT
Indalloy® 301LT offers versatile solder forms &…
Related Applications
Thermal Management
Thermal solutions for HPC ensuring reliability and…
TIM1, TIM1.5, TIM2
Metal-based TIMs deliver high thermal performance and…
Package-Attach
Wide selections to address the challenges in…
Related Markets
Metal TIMs 101: Chapter 2
Folks, A short time ago,I posted"Metal TIMs 101: Chapter 1" with Jon Major. Now it is time for Chapter 2! Dr. Ron: Jon, what is TIM1.5? Jon: TIM1.5 commonly refers to the interface between
The Only Way to Demonstrate Zero Defects is to Sample All of the Product
Folks, Let’s look in on a graduate student of Ivy University… John Foster felt very fortunate. Not only did he get his undergraduate degree summa cum laude, but was now a graduate student
Autonomous Vehicles with Require Electronics and Sensor that Can Survive Harsh Environments
Folks, I chuckle a bit with the angst that has appeared in the smartphone market because the sales of these ubiquitous devices has recently leveled off and decreased slightly. When one considers that
Come See Us at TestConX
I am very excited to be traveling to Mesa, Arizona next week for theTestConX(formerly BiTS) show on March 3-6. I will be traveling with two of my colleagues–Ron Hunadi, Global Accounts Manager
Burn-in and Test Strategies Workshop a Success for Indium Corporation
You don't always know how trade shows will
Newly Developed Thermal Interface Material (TIM)
Folks, The challenge of removing heat from electronics is almost as old as the 100 year old electronics industry. In modern electronics, most of the heat generated is by the integrated circuits (ICs)
A Thought About Data Trends – Fluxes for Indium Soldering
As a young Application Engineer, I was focused on knowing the answer to definite questions. Now I look at data differently – I look for trends. Around 10 years ago testing was done to determine
An Introduction to Burn-in
Indium Corporation offers thermal interfaces to help facilitate the burn-in process for ICs (integrated circuits). This process is an accelerated stress test used to weed out bad components. Please
High-Performance Metal Thermal Interface Options for Burn-In
It is easy to get burned during the burn-in and test process if you don't use the right thermal interface
Your Success
is Our Goal
Optimize your processes with the latest materials, technology, and expert application support. It all starts by connecting with our team.