Our many products are applied to numerous applications. For example, our:
solders are used for mechanical joining, electronics manufacturing, semiconductor device assembly, and more.
alloying expertise finds use in applications ranging from thermal management to thin-film technology to fusible devices.
inorganic compounds are critical ingredients in dry cell batteries, are precursors in the LED MOCVD process, and are used to optimize fiber optic devices, to name a few.
Explore these common applications of our many products, then contact us to tell us how we can work for you.
High-Temperature Soldering & Brazing
Indium Corporation is the leading joining and bonding materials innovator for semiconductor packaging and assembly and PCB assembly applications. With over 200 alloys available, we have alloy solutions for temperatures up to 1,100°C.
Indium Corporation offers materials for hermetic and cryogenic sealing, as well as for pass-throughs. These mission critical applications require unwavering assurances and reliability.
Gold (Au) is often used in electronics assembly because it does not oxidize or tarnish to any appreciable extent. This makes gold ideal for plating contact surfaces for switches and connectors.
NanoFoil®, a nanotechnology material, is used to simplify the sputtering target bonding process in a process called NanoBonding®. NanoBonding allows target bonders and target manufacturers to make reliable and repeatable bonds while increasing margins and lowering capital expenditures.
Indium Corporation offers thermal evaporation materials for thin-film deposition. The purity of source material is as important as the equipment used for deposition. We offer the high quality materials and experienced technical support to help you get the most from your physical vapor deposition (PVD) process.
Indium Corporation is the leader in metal thermal interface materials (TIMs).
All of our thermal interface materials are metal-based, which means they have a very high conductivity as compared to polymer-based thermal interface materials.
