Our many products are applied to numerous applications. For example, our:
solders are used for mechanical joining, electronics manufacturing, semiconductor device assembly, and more.
alloying expertise finds use in applications ranging from thermal management to thin-film technology to fusible devices.
inorganic compounds are critical ingredients in dry cell batteries, are precursors in the LED MOCVD process, and are used to optimize fiber optic devices, to name a few.
Explore these common applications of our many products, then contact us to tell us how we can work for you.
Automotive Electronic Assembly
Indium Corporation’s suite of proven, high-reliability materials, from solder paste to solder preforms, thermal interface materials, innovative solder alloys, metals, and compounds offers enhanced performance in automotive electronics assembly and packaging applications.
Indium Corporation is the leading joining and bonding materials innovator for semiconductor packaging and assembly and PCB assembly applications. With over 200 alloys available, we have alloy solutions for temperatures up to 1,100°C.
Indium Corporation is introducing its Quick Release™ system with a new build plate for metal 3D printing. Our EZ-Print™ plates are geared towards the additive manufacturing technology used in powder bed fusion (PBF) printers. The EZ-Print™ plate uses a low melting point alloy in the top layer; this makes post-print process for removing printed parts fast and easy. Separation is achieved by heating the parts using an oven or hot plate.
A variety of industries including automotive, transportation, computing, and energy infrastructure, are demanding more and more from power electronics systems. As this trend continues, it is critical that we continue to research, develop, and apply materials that address thermal, voiding, and all-around reliability challenges. Indium Corporation is the leader in power electronics assembly materials and leverages a broad portfolio of proven high-reliability solders, alloys, and thermal interface products to enable emerging power electronics solutions.
NanoFoil®, a nanotechnology material, is used to simplify the sputtering target bonding process in a process called NanoBonding®. NanoBonding allows target bonders and target manufacturers to make reliable and repeatable bonds while increasing margins and lowering capital expenditures.
Indium Corporation offers thermal evaporation materials for thin-film deposition. The purity of source material is as important as the equipment used for deposition. We offer the high quality materials and experienced technical support to help you get the most from your physical vapor deposition (PVD) process.