Related Solder Research Kits Technical Documents
Application Notes
- Procedures for Handling Indalloy® (Liquid at Room Temperature) (US Letter)
Folks, In my last post, I discussed the concern for copper-tin intermetallic (IMC) growth in solder joints at high service temperatures. Since then, I have dev...
Read MoreThe introduction point between the pad and the soldeirng iron tip plays a crucial role in creating perfect solder joints, as well as gives clues as to why soldering has gone awry when improper technique is use.
Read MoreFolks, This post is an excerpt on graping, from Indium Corporation's The Printed Circuits Assemblers Guide to Solder Defects. Introductio...
Read MoreFolks, Two of the workers at Ivy-Benson electronics just got engaged and they are on their way to a factory in Mexico to see if their boss Maggie Benson should...
Read MoreFolks, I am presenting a workshop on Defeating Defects at SMTAI on October 31. This workshop is based on the recently published booklet The Printed Circuits As...
Read MoreIn addition, we have the technical expertise to help you select just the right materials for your kit.
Contact us with the following information:
With this information we will be able to suggest one or two alloys for you to try in your manufacturing process. Depending on your manufacturing process, we have kits or evaluation quantities available in a variety of forms.