From water-soluble to no-clean soldering solutions, Indium Corporation’s portfolio of products meets current and evolving challenges encountered in fine-pitch SiP and HIA applications.
Part 3 of the semiconductor flux series talks about the important cleaning function of fluxes and how thermocompression bonding can help prevent warpage and die tilt.
Indium Corporation’s proven SiPaste® series is specifically designed for fine-feature printing with fine powders ranging from Type 5 to Type 7. They help Avoid the Void®, reduce slumps, and demonstrate consistent superior printing performance. SiPaste® 3.2HF has been adopted by leading OSATs and has been used in more than 5 billion mobile FEM SiP modules.
SiPaste® 3.2HF formulation offers consistent, repeatable printing performance combined with a long stencil life and sufficient tack strength to handle the challenges of today’s miniaturization in System-in-Package (SiP) design. In addition to consistent printing and reflow requirements, this solder paste offers superb wetting to the various Pb-free metallizations and has exceptional low-voiding performance on fine-pitch components, including BGAs and CSPs.
WS-446HF is a robust, halogen-free, water-wash flux designed to provide one simple solution to complicated applications, especially those with a single cleaning step for both BGA ball-attach and flip-chip processes.
Promotes excellent solderability and wetting on a wide range of surfaces
Cleans well with room temperature DI water
Eliminates ECM or dendrite formation caused by residue
Minimizes die skew, non-wet-opens, and “missing balls”
Designed for Pb-free applications
Halogen-free – per IPC and IEC specifications
Ensures consistent joint quality by providing consistent dipping, pin transfer, and printing performance over extended periods
Promotes strong, low-voiding joints
Eliminates warpage due to “prefluxing” with lower process costs
Indium Corporation’s near-zero residue and ultra-low residue flip-chip fluxes are halogen-free, no-clean dipping fluxes, designed to leave a very small amount of a benign, solid, clear residue after reflow. By reducing the residue quantity, the flux allows the flow of capillary or molded underfills (CUF/MUF) without underfill voiding, and its benign chemical nature optimizes the strength of the flux/underfill interface. By eliminating the cleaning process, these fluxes also eliminate the excessive stresses on the die and solder joints caused by every aspect of flux cleaning: jet impingement, ultrasonic and megasonic vibration, air-knife drying, warpage during drying, and unnecessary handling.
Copper-pillar and standard bump flip-chip dipping
Suited for high-tin alloys
Near-zero or ultra-low residue levels (NZR/ULR) post-reflow
WS-829 is a halogen-free water-soluble ball-attach and LED die-attach flux designed for use in pin transfer and printing applications for ball-attachment to substrates (BGA manufacturing) and wafer/panel (WLP/PLP manufacturing), as well as in miniLED and microLED die-attach applications.
Halogen-free—per IPC and IEC specifications
Flux rheology suitable even for smallest sphere size
Thixotropic property ensures good print definition with minimal slump
Promotes excellent solderability and wetting on a wide range of surfaces
Promotes strong, low-voiding joints
Cleans well with room temperature DI water
Designed for Pb-free applications
Ensures consistent joint quality by providing consistent pin transfer and printing performance over extended periods
Jetting and microdispense solder pastes are specifically formulated for fine-pitch and ultra-fine dispensing/jetting for various applications. Indium Corporation’s jetting and microdispensing pastes provide reliable dispensing of consistently sized and shaped deposits in automated dispensing or jetting equipment.
Long-term collaboration with leading jetting and microdispense equipment manufacturers has led to specific recommendations
Exceptional jetting and microdispensing performance for halogen-free SAC305 solder pastes
Precision flux and paste manufacturing eliminates air bubbles and inhomogeneity
