From water-soluble to no-clean soldering solutions, Indium Corporation’s portfolio of products meets current and evolving challenges encountered in fine-pitch SiP and HIA applications.
Stencil technology has evolved throughout the years, and System-in-Package solder pastes require specific stencil manufacturing processes and novel technology to achieve great transfer efficiency. Learn more at my upcoming SiP Printing 101 Webinar!
Just as important in the solder paste printing process is solder paste inspection; how do you know if your printer is operating optimally if your SPI machine is not doing the same? Learn more in my upcoming SiP Printing 101 Webinar.
Choosing the correct solder paste formulation is critical for System-in-Package assembly. Indium Corporation's SiPaste® solder pastes offer a complete portfolio of pastes to choose from to fit many assembly processes. Learn more in the upcoming SiP Printing 101 Webinar!
The BGA ball-mount process may seem uninteresting and trivial at first glance. However, the soldering steps are complex and can lead to problematic failures. Indium Corporation's ball-attach fluxes, such as WS-446HF, WS-823, and WS-829, were formulated to not only prevent these failures, but to eliminate some of the process steps which could cause these failures in the first place.
For dot jetting down to 800µm diameter and above, and fine-line dispensing for metal lid-attach
SiPaste® Solder Paste
SiPaste® Solder Paste
SiPaste® 3.2HF
Water-wash
Yes
SAC305 and other Pb-free alloys
Type 6-SG solder paste suitable for ultrafine-pitch printing
Yes
SAC305 and other Pb-free alloys
Type 6-SG solder paste suitable for ultrafine-pitch printing
SiPaste® Solder Paste
SiPaste® 8.9HF
Solvent- or no-clean
Yes
SAC305 and other Pb-free alloys
Type 6-SG solder paste suitable for ultrafine-pitch printing
SiPaste® Solder Paste
SiPaste® SMQ77
No-clean
Yes
SAC305 and other Pb-free alloys
Type 6-SG solder paste suitable for ultrafine-pitch printing
Die-Attach Solder Paste
Die-Attach Solder Paste
SMQ75
No-Clean ("Power-Safe")
Yes
Yes
All high-Pb and Sb-containing alloys
Ultra-low residue "Power-Safe" (no-clean) paste suitable for clip-bonded devices
SiPaste®
Indium Corporation’s proven SiPaste® series is specifically designed for fine-feature printing with fine powders ranging from Type 5 to Type 7. They help Avoid the Void®, reduce slumps, and demonstrate consistent superior printing performance. SiPaste® 3.2HF has been adopted by leading OSATs and has been used in more than 5 billion mobile FEM SiP modules.
SiPaste® 3.2HF formulation offers consistent, repeatable printing performance combined with a long stencil life and sufficient tack strength to handle the challenges of today’s miniaturization in System-in-Package (SiP) design. In addition to consistent printing and reflow requirements, this solder paste offers superb wetting to the various Pb-free metallizations and has exceptional low-voiding performance on fine-pitch components, including BGAs and CSPs.
WS-446HF is a robust, halogen-free, water-wash flux designed to provide one simple solution to complicated applications, especially those with a single cleaning step for both BGA ball-attach and flip-chip processes.
Promotes excellent solderability and wetting on a wide range of surfaces
Cleans well with room temperature DI water
Eliminates ECM or dendrite formation caused by residue
Minimizes die skew, non-wet-opens, and “missing balls”
Designed for Pb-free applications
Halogen-free – per IPC and IEC specifications
Ensures consistent joint quality by providing consistent dipping, pin transfer, and printing performance over extended periods
Promotes strong, low-voiding joints
Eliminates warpage due to “prefluxing” with lower process costs
Indium Corporation’s near-zero residue and ultra-low residue flip-chip fluxes are halogen-free, no-clean dipping fluxes, designed to leave a very small amount of a benign, solid, clear residue after reflow. By reducing the residue quantity, the flux allows the flow of capillary or molded underfills (CUF/MUF) without underfill voiding, and its benign chemical nature optimizes the strength of the flux/underfill interface. By eliminating the cleaning process, these fluxes also eliminate the excessive stresses on the die and solder joints caused by every aspect of flux cleaning: jet impingement, ultrasonic and megasonic vibration, air-knife drying, warpage during drying, and unnecessary handling.
Copper-pillar and standard bump flip-chip dipping
Suited for high-tin alloys
Near-zero or ultra-low residue levels (NZR/ULR) post-reflow
WS-829 is a halogen-free water-soluble ball-attach and LED die-attach flux designed for use in pin transfer and printing applications for ball-attachment to substrates (BGA manufacturing) and wafer/panel (WLP/PLP manufacturing), as well as in miniLED and microLED die-attach applications.
Halogen-free—per IPC and IEC specifications
Flux rheology suitable even for smallest sphere size
Thixotropic property ensures good print definition with minimal slump
Promotes excellent solderability and wetting on a wide range of surfaces
Promotes strong, low-voiding joints
Cleans well with room temperature DI water
Designed for Pb-free applications
Ensures consistent joint quality by providing consistent pin transfer and printing performance over extended periods
Jetting and microdispense solder pastes are specifically formulated for fine-pitch and ultra-fine dispensing/jetting for various applications. Indium Corporation’s jetting and microdispensing pastes provide reliable dispensing of consistently sized and shaped deposits in automated dispensing or jetting equipment.
Long-term collaboration with leading jetting and microdispense equipment manufacturers has led to specific recommendations
Exceptional jetting and microdispensing performance for halogen-free SAC305 solder pastes
Precision flux and paste manufacturing eliminates air bubbles and inhomogeneity
