Related Tin Metal Videos
Tin and Laser Produced Plasma (LPP)
Process Capability: Cpk and Cpu in Relation to Purity of Compounds from Indium Corporation
6 Alloy Families: Tin
With a melting point of 231.93°C (449.47°F) and its corrosion-resistant nature, tin, especially high-purity Tin (3N5 to 6N), is becoming increasingly popular for a number of new and innovative applications, including aerospace and semiconductors.
When reliability counts, our customers don’t settle for lower levels of tin purity that can lead to failure. Indium Corporation sources tin directly and can ensure its purity in a number of physical forms and levels of up to 99.9999% purity (6N).
Ever increasing purity levels are needed for new application fields such as EUV lithography electroplating for high-end electronics, temperature calibration standards, and SEM substrate discs.
Indium Corporation sets the standard, from the mine to product packaging, for the processing of commercial and high-purity indium, germanium, gallium, and tin metals. Quality is assured because we control the production process from the very first step.
Typical Impurities (ppm)
|Total ppm level||<500||<100||<20||<10||<1||*Limited availability|
Indium Corporation has the production capability to deliver levels of up to 99.9999%-pure (6N) tin. Availability of 5N/6N purity is limited. Testing is available upon request for specific impurities.
Available Physical Forms of Tin (Sn):
Don’t manage multiple tin (Sn) suppliers. Indium Corporation offers a one-source solution for tin in purity levels of up to 99.9999%-pure (6N) in a number of physical forms. We source crude tin (Sn) and have the capability to convert it into the shape and geometry needed for your application.
- Customer fabrications (sphere, wire, tubing, and more)
|Tin (Sn) Physical Properties|
|Melting Point||505.08 K (231.93°C or 449.47°F)|
|Boiling Point||2875 K (2602°C or 4715°F)|
|Phase at Room Temperature||Solid|
|Vapor Pressure||986x10-6 Pa at 1000°C|
|Surface Tension||544 mN/M at MP|
|Viscosity at Melting Point||1.85 m·Pa (=cP)|
|Specific Heat @ 20°C||222 J/(kg·K)|
|Latent Heat of Fusion||14.2 cal/g|
|Thermal Conductivity @ 20°C||65 W(m·K)|
|Coefficient of Linear Expansion||19.9 x10-6 at 0OC|
|Shrinkage on Solidification||2.80%|
|Volume Conductivity||15 IACS|
|Brinell Hardness @ 20°C||3.9 (10kg, 5mm, 180s)|
|Tensile Strength @ 15°C||2100 psi|
|Latent Heat of Vaporization||520+/-20 cal/g|