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Features & Benefits
Indium Corporation manufactures NanoFoil®, a nanotechnology material that delivers energy in a controlled and precise manner for joining, energetics and heating applications.
NanoFoil® is a reactive multi-layer foil that provides instantaneous heat for a variety of applications in many industries (semiconductor, aerospace, automobile, electronics, biomedical and defense markets). NanoFoil® is a predictable, controllable and affordable material that is industry accepted and proven to lower manufacturing costs while providing repeatable and reliable bonds and reactions.
Indium Corporation has scaled NanoFoil® production to high volume in an ISO certified process and is committed to helping customers realize the technical and economic benefits NanoFoil® provides.
This reactive multi-layer foil is fabricated by vapor-depositing thousands of alternating nanoscale layers of Aluminum (Al) and Nickel (Ni). When activated by a small pulse of local energy from electrical, optical or thermal sources, the foil reacts exothermically to precisely deliver localized heat up to temperatures of 1500°C in fractions (thousandths) of a second.
Traveling approximately eight meters per second, the reaction's rapid delivery coupled with its localized and versatile nature makes it ideal for many types of bonding and reaction initiation (energetics) applications.
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Benefits of NanoFoil®
Customers around the world have discovered the unique benefits of NanoFoil® and NanoBond® to solve their current bonding challenges.
- Instantaneous soldering at room temperature
- No thermal damage - components not exposed to reflow temperatures
- Compatible with all solders
- Environmentally friendly, Pb free, and RoHS compliant
- No license fees
- Elimination of expensive reflow equipment
- Easy to ignite with heat, electrical or laser pulse
- Electrically conductive
- Minimal pressure required
- Safe and shipped around the world daily
- 10x drop in thermal resistance over conventional thermal interface materials
- Available in any 2D shape
- Compatible with all Pick and Place equipment
Applications of NanoFoil®
- Sputtering Target Bonding
- Electronics Assembly
- Thermal Management