Products NanoFoil®

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NanoFoil® is a versatile reactive multi-layer foil that delivers instantaneous heat for a wide range of applications across numerous industries, including semiconductor, aerospace, automotive, electronics, biomedical, and defense. As a reliable heat source, NanoFoil® offers predictable and controllable heating, enabling localized soldering without subjecting surrounding components to unwanted heat exposure.

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Instant, Precise Soldering at Room Temperature
Universal Solder Compatibility
Facilitates Fluxless Soldering

製品概要

Solderable Surfaces Required

Standard- and Tin-Plated NanoFoil^®

NanoFoil® is a localized heat source that enables material joining below 450°C and is available in two options: standard, which is used with solder preforms or coated surfaces, and tin-plated, which features 10 μm of pure tin on both sides for direct bonding to solderable surfaces.

Reactive Multi-Layered Foil

Vapor-deposited layers of aluminum and nickel deliver up to 1,500°C of localized heat in milliseconds, activated by a small energy pulse—ideal for rapid, precise bonding and reaction initiation.

NanoFoil^® Activation

NanoFoil® can be activated with a small pulse of local energy applied using optical, electrical, or thermal sources. Applying energy at a specific point is just as important as the total amount of energy applied.

特徴

NanoBond® is the process of bonding two components with solder using NanoFoil® as a heat source. When activated, the foil creates a self-sustaining reaction that acts as a rapid and controllable localized heat source to melt adjoining solder layers, bonding components together.

1,350°–1,500°C (2,460°–2,730°F)

Maximum Reaction Temperature

6.5–8 meters/second

Reaction Velocity

1,050–1,250J/g

Heat of Reaction

35–50W/mK

熱伝導率

NanoFoil^® Specification Recommendations

NanoFoil® is offered in standard sheet form, 43″ x 9″, or can be customized to meet your specifications with sizes as small as 1 mm x 1 mm. It is available in two thicknesses: 40 μm and 60 μm. Plus, NanoFoil® can be enhanced with a tin plating option, featuring a 10 μm layer of pure tin on both sides. This tin-plated NanoFoil® only requires solderable surfaces for effective bonding.

Recommended NanoFoil^®	Component #1 Plating	Component #2 Plating
Tin-plated	ENIG, Au, Ag	ENIG, Au, Ag
Tin-plated	ENIG, Au, Ag	Solder-plated
Standard using solder preforms*	ENIG, Au, Ag	ENIG, Au, Ag
スタンダード	Solder-plated	Solder-plated