プリント基板（PCB）アセンブリ

Folks, Richard asks: Dear Dr. Ron, Recently we had a solderability problem with tin-finished component leads and SAC305 solder paste. One of our engineers claimed that the problem was that the tin

If you haven’t heard about Bi-containing (bismuth) solder alloys recently, that may change in the near future. Low-melting Bi-containing solders are now in increasing use and gaining popularity due

A wave solder machine’s foam fluxer is a device in which compressed air is fed through a porous tube (commonly referred to as a “stone” because this part used to be made out of

SigFolks, Let’s check in on Patty as she is about to wrestle with claims of a 10 Sigma Solder Paste Printing Process involving the world’s smallest electronics components, known as

SMT Optimization for Success Part 6: Solder Paste Particle Size and Its Effect on Stencil Printing Ultra-fine Solder Paste Deposits This final post in a series on the stencil printing aspect of SMT

皆さん、前回の投稿で述べたように、PIP（ピン・イン・ペースト）工程でよくある問題ですが、適切なはんだを得るのに苦労します。

Part 5: Solder Mask Defined vs. Copper Defined (Non-Solder Mask Defined) Pads Figure

微細なペーストを印刷するためのソルダーペースト印刷を改善するための継続的な調査と探求において、我々はまた、一貫性（低標準偏差）は、以下の場合に正方形の開口部が有利であることを発見しました。

SMT Optimization for Success Part 3: Flux Chemistry In our continued discussion on optimizing the stencil printing process (see Part 1, Part 2), the type of flux chemistry, specifically water-soluble