パッケージ・オン・パッケージ・アセンブリ

みなさん、パティの様子を見ましょう......。パティは正直、イライラしていた。工学部の女子学生2人が、いつも夫のロブのオフィスに出入りしているのだ。

Following on from our discussions of last time… As you will recall from the previous post on this topic, My friend and colleague Chris Nash and I were discussing some puzzling results for low

My friend and colleague Chris Nash and I were recently discussing some puzzling results for low dip height found during testing of package-on-package (PoP) materials. The findings will be of interest

This week a customer in Asia asked why one of our new epoxy fluxes was not allowing the package-on-package (PoP) device to be picked up from the dipping tray. Obviously, the vacuum nozzle must have

After you've reflowed solder in contact with a flux, you're always left with a certain amount of flux residue. There are no clear industry guidelines on how you refer to the residue, and new

Before even thinking of dipping a component, you had better verify that your paste or flux is 1) the proper thickness and 2) uniform across the surface of the flux reservoir. You can check this by

Package-on-Package solder paste is a relatively new concept in the solder industry. With limited material sets, we need to be able to capitalize on the flexibility of the few solder pastes that are

しばしば人々は、ディッピングのプロセスは簡単だと思い込んでいる。この最適化には少し時間がかかり、試行錯誤が必要だ。

ディッピング・プロセスによるエポキシ・フラックスの塗布は、従来のPoPフラックスによるディッピング・プロセスと似ているが、部品バンプのフラックス被覆率は異なる。