包上组装

Package-on-package (PoP) assembly stacks silicon chips to maximize component density, making it ideal for compact devices like smartphones. Indium Corporation offers specialized expertise in PoP process technology, along with proven solder pastes and fluxes, to optimize motherboard space—enabling more powerful and energy-efficient devices.

获取支持

概述

PoP Assembly for Enhanced Electronics Manufacturing

With PoP, manufacturers can shrink the footprint of integrated circuits on a device’s motherboard, optimizing space for more powerful or energy-efficient devices. The process typically consists of printing solder paste on the substrate, placing the logic chip, dipping the memory package in PoP flux or solder paste, and reflowing the assembly. Indium Corporation’s PoP materials are designed for maximum flux or paste transfer to component bumps while ensuring volume consistency.

益处

High-Performance Materials for Efficient PoP Assembly

顶级精度

Our materials are engineered with ideal viscosity and rheology to ensure maximum transfer to component bumps while maintaining consistent volume.

高收益

Advanced flux technology contributes to higher end-of-line yields by reducing defects and enhancing overall assembly quality.

Improved Wetting and Solderability

Excellent wettability and solderability are crucial for creating strong and reliable solder joints, ensuring the mechanical reliability and electrical performance of the assembled package.

Application Flexibility

Materials can be applied by dipping or dispensing, offering versatility in the assembly process and significant equipment cost savings by not requiring precise control of flux volume and reflow.

包装上包装产品

Indium Corporation’s PoP materials are crafted with optimal viscosity, advanced flux technology, and excellent wettability. They offer high yields and application flexibility, ensuring precision and reliability with strong solder joints.