应用
包上组装
Package-on-package (PoP) assembly stacks silicon chips to maximize component density, making it ideal for compact devices like smartphones. Indium Corporation offers specialized expertise in PoP process technology, along with proven solder pastes and fluxes, to optimize motherboard space—enabling more powerful and energy-efficient devices.
概述
PoP 组装促进电子产品制造
With PoP, manufacturers can shrink the footprint of integrated circuits on a device’s motherboard, optimizing space for more powerful or energy-efficient devices. The process typically consists of printing solder paste on the substrate, placing the logic chip, dipping the memory package in PoP flux or solder paste, and reflowing the assembly. Indium Corporation’s PoP materials are designed for maximum flux or paste transfer to component bumps while ensuring volume consistency.
益处
用于高效 PoP 组装的高性能材料
顶级精度
我们的材料具有理想的粘度和流变性，可确保最大程度地传递到组件凸点，同时保持稳定的体积。
高收益
先进的助焊剂技术可减少缺陷并提高整体装配质量，从而提高生产线末端的产量。
改善润湿性和可焊性
出色的润湿性和可焊性对于形成牢固可靠的焊点、确保组装封装的机械可靠性和电气性能至关重要。
应用灵活性
材料可以通过浸渍或点涂的方式进行涂敷，从而为装配工艺提供了多样性，并且由于不需要精确控制助焊剂量和回流焊，从而大大节省了设备成本。
包装上包装产品
Indium Corporation’s PoP materials are crafted with optimal viscosity, advanced flux technology, and excellent wettability. They offer high yields and application flexibility, ensuring precision and reliability with strong solder joints.
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