应用
半导体测试
The most stringent application requirements for thermal interface materials (TIMs) are found in semiconductor testing. This environment presents challenges such as increased power, elevated heat flux, larger die sizes, and greater warpage that must be effectively managed. For semiconductor testing, compressible soft metal alloys like indium have become the industry standard. Specifically engineered for system-level test, functional test, and burn-in and testing processes, these recyclable materials support multiple insertions, improve process yields, and offer ease of use.
概述
Improve Process Yields With Heat-Spring® HSK
Heat-Spring® HSK features a textured pattern on one side and an aluminum-clad barrier layer on the other, ensuring durability through numerous insertions. The thin aluminum layer facing the device under test (DUT) prevents the soft metal from adhering to the surface, effectively reducing the risk of stains and cracks.
益处
增强不平整表面的间隙填充和隔热性能
可持续的 TIM
Metal TIMs are easy to handle, 100% recyclable, and eligible for credit upon return. Multiple alloys are available depending on operating temperature requirements.
灵活
适应性强的格式可弯曲 90°，并可缠绕各种测试头/插座盖配置，包括万向节测试头。
性能
表面图案设计可降低接触电阻，在 50 psi 压力下提供与焊料相当的热性能。此外，还提供压力更低的新选项。
多次插入
The aluminum-clad layer on the DUT prevents staining and sticking, allowing it to be used for hundreds of cycles.
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