Markets Mobile

移动设备

Person with mobile device

A detailed close-up view of mobile phone internal components, showcasing intricate circuit designs and technology, perfect for illustrating modern electronics and innovation.

更精细的功能,更大的挑战

As mobile devices continue to shrink, new challenges such as artificial intelligence, 5G integration, and sustainability add complexity for manufacturers. Indium Corporation offers advanced electronics packaging and assembly materials, including fine powders for precise printing or jetting, and innovative products for system-in-packaging assembly, helping you meet the demands of miniaturization.

Revolutionizing Mobile Manufacturing
with Innovative Soldering Solutions

尖端技术

Our patented Durafuse® LT is the only solution that seamlessly merges low-temperature properties with high reliability for mobile devices.

专家推荐

凭借数十年的经验,我们的团队精挑细选最佳材料,确保最终产品的可靠性和高产量。

Enhanced Reliability

From reducing HIP defects to ensuring low-voiding and excellent electrical reliability, our materials are engineered for unmatched consistency and performance.

Versatile Applications

Our extensive range of solder pastes, fluxes, and alloys is customized to address a variety of needs in mobile device manufacturing, including PCBA and SIP applications, as well as semiconductor packaging for sensors.

相关应用

印刷电路板板上的微芯片

PCB

经过验证且处于行业前沿PCB 材料

SiP & Heterogeneous Integration Assembly (HIA)

系统级封装(SiP) 异构集成 (HIA)

System-in-package (SiP) and heterogeneous integration solutions

低温

低温

Transform your operations with our low-temp soldering