移动设备
Mobile devices are facing greater demands than ever—better cameras, sharper displays, and longer battery life—all packed into even smaller, more compact designs.


概述
更精细的功能,更大的挑战
As mobile devices continue to shrink, new challenges such as artificial intelligence, 5G integration, and sustainability add complexity for manufacturers. Indium Corporation offers advanced electronics packaging and assembly materials, including fine powders for precise printing or jetting, and innovative products for system-in-packaging assembly, helping you meet the demands of miniaturization.
Products for Mobile Devices Assembly


显示屏和触摸传感器

Camera Module

充电器材料

主逻辑板 (MLB)

Low-Temperature Shield and Interposer Attach

GaAs RF Chips

Flexible Printed Circuit (FPC)

System-in-Package (SiP)

Connector

MEMS Microphone
益处
Revolutionizing Mobile Manufacturing
with Innovative Soldering Solutions
尖端技术
Our patented Durafuse® LT is the only solution that seamlessly merges low-temperature properties with high reliability for mobile devices.
专家推荐
凭借数十年的经验,我们的团队精挑细选最佳材料,确保最终产品的可靠性和高产量。
Enhanced Reliability
From reducing HIP defects to ensuring low-voiding and excellent electrical reliability, our materials are engineered for unmatched consistency and performance.
Versatile Applications
Our extensive range of solder pastes, fluxes, and alloys is customized to address a variety of needs in mobile device manufacturing, including PCBA and SIP applications, as well as semiconductor packaging for sensors.
相关应用
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是我们的目标
借助最新的材料、技术以及专家应用 优化您的生产流程。一切都始于与我们团队的联系。






