Markets High-Performance Computing

高性能计算

在一间光线昏暗的服务器机房里,一个人在发着蓝光的服务器中精确地操作着笔记本电脑,就像复杂的计算机焊接艺术。

Partner with Indium Corporation for High-Performance Computing Success

From solder pastes and semiconductor fluxes to thermal interface materials, the precise selection, combination, and application of these components are crucial for high production yields and exceptional product quality. Indium Corporation excels in this area, providing technical expertise and service to help customers effectively implement the optimal combinations of materials.

Main Board

  • Non-tacky residue with excellent ICT performance
  • Excellent HIP and NWO performance
  • 卓越的保形涂料兼容性
  • More than two orders of magnitude better than Bi-containing low-temperature materials
  • TCT 性能可能优于 SAC305
  • Added solder volume to improve mechanical reliability
  • WF-7745 VOC-free flux
  • WF-9945 Rosin-containing flux

Memory Module

  • Restricted flux residue
  • Excellent transfer efficiency
  • Improving drop shock resistance
  • 提高 TCT 的绩效

Graphic Card

  • Eliminates HIP and NWO when BGAs warp
  • Excellent wetting on different surfaces

Power Device

  • Reduce ground pad voiding
  • Less flux residue, enhance SIR performance

Connector

  • Added solder volume to improve mechanical reliability

Heat-Sink

  • 压缩在两个表面之间,无需回流
  • High thermal conductivity
  • Excellent thermal cycling performance

相关应用

印刷电路板板上的微芯片

PCB

经过验证且处于行业前沿PCB 材料

具有网格状结构和反射光泽的彩色图案微型芯片表面特写。

半导体封装和装配

关键半导体封装可确保功能性和可靠性

一张电路板 上的计算机微芯片特写电路板 可见电子元器件 电路图案。

热管理

面向高性能计算(HPC)的散热解决方案,确保可靠性 最佳性能

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作为以技术专长和创新解决方案著称的全球领导者,我们确保您的产品超越行业标准,提供无与伦比的性能和可靠性。与我们合作,体验尖端技术和卓越服务——铟泰公司 。