高性能计算
High-performance computing (HPC) is a driving force behind innovation and efficiency in electronics assembly and semiconductor packaging, and it requires advanced materials to do so. It fuels the rapid development of electronic products and systems around the world. Plus, it is essential for developing cutting-edge technologies like artificial intelligence (AI), and machine learning, which rely on sophisticated semiconductor designs and packaging solutions.


概述
Partner with Indium Corporation for High-Performance Computing Success
From solder pastes and semiconductor fluxes to thermal interface materials, the precise selection, combination, and application of these components are crucial for high production yields and exceptional product quality. Indium Corporation excels in this area, providing technical expertise and service to help customers effectively implement the optimal combinations of materials.


Main Board
- Non-tacky residue with excellent ICT performance
- Excellent HIP and NWO performance
- 卓越的保形涂料兼容性
- More than two orders of magnitude better than Bi-containing low-temperature materials
- TCT 性能可能优于 SAC305
- Added solder volume to improve mechanical reliability
- WF-7745 VOC-free flux
- WF-9945 Rosin-containing flux

Memory Module
- Restricted flux residue
- Excellent transfer efficiency
- Improving drop shock resistance
- 提高 TCT 的绩效

Graphic Card
- Eliminates HIP and NWO when BGAs warp
- Excellent wetting on different surfaces

Power Device
- Reduce ground pad voiding
- Less flux residue, enhance SIR performance

Connector
- Added solder volume to improve mechanical reliability

Heat-Sink
- 压缩在两个表面之间,无需回流
- High thermal conductivity
- Excellent thermal cycling performance
相关应用

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