
概述
新一代焊料
Indium Corporation’s Durafuse® technology represents a major breakthrough in electronic manufacturing, particularly in improving solder joint quality and reliability for complex designs. This technology is trusted in mobile, automotive, and industrial applications for its unique features and ability to address complex challenges.
Since its patented introduction in 2021, Durafuse® has proven its capabilities in key industries such as mobile technology and automotive, enabling users to lead the next wave of innovative designs.
Durafuse®技术的优点
辅助技术
With its unique design, the patented Durafuse® technology has been proven to solve a wide range of design challenges and enable our customers to achieve a next generation of products.
高可靠性
Durafuse® 技术的开发是为了在具有挑战性的设计和环境中形成牢固可靠的连接。
可持续发展
Durafuse® is designed to achieve high reliability at lower processing temperatures, helping to reduce your carbon footprint or replace Pb-containing materials in high-temperature die-attach applications.
Durafuse®技术产品
Durafuse® 品牌有三个主要产品系列--Durafuse® LT、Durafuse® HR 和 Durafuse® HT--每个产品系列都经过专门设计,以满足独特的要求。
Durafuse®LT
High Reliability in Low-Temperature Applications
Durafuse® LT is a patented low- to mid-temperature mixed solder alloy system developed by Indium Corporation, specifically designed for high-reliability applications that require a lower reflow temperature. Leading original equipment manufacturers (OEMs) and electronics manufacturing services (EMS) have embraced this versatile solder paste technology for various high-reliability applications, attracted by its numerous advantages and strengths.
Durafuse®HR
Achieve Superior Voiding Performance
Durafuse® HR is a patented mixed solder paste alloy developed by Indium Corporation to achieve low voiding without the need for vacuum reflow in high-reliability applications, such as automotive and aerospace. Durafuse® HR offers a unique option with distinct advantages for high-reliability solder paste.
Durafuse®HT
耐高温焊膏
As the standout in the Durafuse® mixed alloy family, Durafuse® HT is a Pb-free solder paste engineered as a direct replacement for traditional high-Pb die-attach solders. Designed for applications that demand re-melting temperatures higher than standard PCBA reflow levels (up to 260°C), this is the only Pb-free solution available on the market that meets this specific requirement.
相关应用
The Durafuse® Technology family is suitable for a variety of solder paste applications.
相关市场
Durafuse® Technology is widely used in various markets, including automotive, EV, industrial, and mobile.
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