^Durafuse®技术

Durafuse® 是我们最先进的混合合金技术的发展，旨在应对电子组装领域不断变化的挑战。

由铟泰公司提供支持

尖端技术
值得信赖的创新
专用设计

概述

新一代焊料

Indium Corporation’s Durafuse® technology represents a major breakthrough in electronic manufacturing, particularly in improving solder joint quality and reliability for complex designs. This technology is trusted in mobile, automotive, and industrial applications for its unique features and ability to address complex challenges.

自 2021 年获得专利以来，Durafuse® 已在移动技术和汽车等关键行业证明了自己的能力，使用户能够引领下一波创新设计浪潮。

^Durafuse®技术的优点

辅助技术

凭借其独特的设计，Durafuse® 专利技术已被证明能够解决各种设计难题，使我们的客户能够实现新一代产品。

高可靠性

Durafuse® 技术的开发是为了在具有挑战性的设计和环境中形成牢固可靠的连接。

可持续发展

Durafuse® 可在较低的加工温度下实现高可靠性，有助于减少碳足迹或在高温贴片应用中替代含铅材料。

^Durafuse®技术产品

Durafuse® 品牌有三个主要产品系列--Durafuse® LT、Durafuse® HR 和 Durafuse® HT--每个产品系列都经过专门设计，以满足独特的要求。

^Durafuse®LT

低温应用中的高可靠性

Durafuse® LT is a patented low- to mid-temperature mixed solder alloy system developed by Indium Corporation, specifically designed for high-reliability applications that require a lower reflow temperature. Leading original equipment manufacturers (OEMs) and electronics manufacturing services (EMS) have embraced this versatile solder paste technology for various high-reliability applications, attracted by its numerous advantages and strengths.

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^Durafuse®HR

实现卓越的排气性能

Durafuse® HR is a patented mixed solder paste alloy developed by Indium Corporation to achieve low voiding without the need for vacuum reflow in high-reliability applications, such as automotive and aerospace. Durafuse® HR offers a unique option with distinct advantages for high-reliability solder paste.

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^Durafuse®HT