半导体封装和装配

Achieving efficiency, reliability, and exceptional thermal performance is crucial in package-attach soldering applications for power modules. However, the high reflow temperatures required by

A little over a year ago, I posted about the increase in interest regarding Cu sintering. In the past 12 months, that interest has has surged, highlighting Cu sintering's suitability for various

During my first few weeks as a Technical Support Engineer at Indium Corporation, Iresearched extensively and consulted with my team to find out when flux should be used and why it’s essential

Folks, I am working on a book with my Indium Corporation colleagues on tackling soldering defects in electronics.It is a follow up to our The Printed Circuits Assembler's Guide to Solder Defects.

在当今快节奏的世界中，可持续发展和环境责任至关重要，铟公司正以创新的资源管理方法引领潮流。我们的

各位，在今天的博客中，我们将采访帕梅拉-尼尔森（Pamela Nelson）。她是 Indium 公司密封产品的产品专家。Indium 公司的产品专家帕梅拉-尼尔森。

InFORMS® 概览 在电子产品制造领域，尤其是在电源模块和电动汽车逆变器等高压力应用中，确保可靠性和耐用性是至关重要的。

各位，彼得来信亲爱的罗恩博士，您的 Excel® 程序可以计算 IMC 厚度与时间的函数关系，我非常喜欢。但是，我想计算程序中没有列出的时间的 IMC 厚度。

朋友们，我有点 "小屋热"，所以我想去 Simon Pearce 吃午饭。那里的氛围总能让我感到放松和神清气爽。于是，服务员给我安排了一个小桌子。