半导体封装和装配

As semiconductor packaging technologies evolve to meet industry demands of smaller, faster, higher power, more reliable, more efficient devices, packaging and assembly materials play a crucial role. From industry leading die attach solder pastes, ultra-fine solder pastes for SiP, to innovative flux technology for flip-chip bonding and BGA ball attach. Indium Corporation’s semiconductor packaging and assembly materials address todays challenges and help power the future.

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Two people in lab coats examine a circuit board in a laboratory setting.

概述

Semiconductor packaging and assembly are critical to manufacturing semiconductor devices, ensuring functionality, efficiency, and reliability. This back-end-of-line (BEOL) process involves encapsulating the silicon die or integrated circuit (IC) to ensure reliable electrical connections to the PCB and other systems. It’s essential for maintaining functionality and durability in diverse environments. Indium Corporation’s expertise in these processes and product selection meets the unique needs of the industry.

益处

经过验证的材料

Indium Corporation’s advanced products have been integral in the advancement of semiconductor assembly. Our wafer bumping flux WS-3401 and flip-chip flux WS-641 are widely used in 2.5D and advanced semiconductor assembly.

引领潮流

Over a decade ago, Indium Corporation introduced the first ultra-low residue flux and has remained a pioneer in the field, offering a diverse range of ultra-low residue fluxes.

^SiPaste®3.2HF

For over a decade, true washable SiPaste®3.2HF has been the preferred choice for millions of SiP modules.

无通量

Through collaboration with industry leaders, we have developed a fluxless adhesive solution for advanced flip chip attachment.

20 年

With over 20 years of proven performance, our SMQ75 high-temperature high Pb paste remains the industry standard for die-attach on leadframe applications.

高温无铅

We’re proud to introduce Durafuse® HT, a drop-in Pb-free solution for replacing Pb-containing solders in high-temperature applications.

50 亿美元

To date, over 5 billion front-end SiP modules have been manufactured using Indium Corporation’s semiconductor materials, with continuous growth expected.

可持续性

These fluxes enable a true no-clean process, driving sustainability by reducing costs related to cleaning chemicals, water, and energy consumption.

半导体封装和装配的基本考虑因素

半导体组装涉及将半导体芯片或集成电路封装并互连到基板上以制造功能电子设备的过程。半导体封装 涉及以下关键考虑因素：

Interconnect Reliability

确保稳固的电气连接，最大限度地减少信号损失和电阻。

热管理

采用高效的散热解决方案，防止过热并保持设备性能。

材料兼容性

Selecting packaging materials with compatible coefficients of thermal expansion (CTE) to reduce stress on interconnects and prevent mechanical failures due to thermal cycling.

半导体封装与组装产品

Indium Corporation offers a full line of wave fluxes that can meet the needs of numerous selective soldering applications. For example, the WF-9948 flux is excellent for those applications where reliability and minimal post-soldering residues are required.