Applications Thermal Evaporation and PVD Coating

应用

热蒸发和 PVD 涂层

Thermal evaporation and physical vapor deposition (PVD) are two techniques used to apply thin films and coatings to various substrates. The purity of the source material is just as crucial as the deposition equipment. Indium Corporation provides high-quality materials, particularly indium and gallium, specifically for the electronics and semiconductor industries. Plus, we offer experienced technical support to help you optimize your PVD process.

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概述

实现薄膜沉积的高质量和高效率

Thermal evaporation and PVD are both techniques for thin film deposition, each utilizing different methods. These processes are crucial across various industries, including electronics, automotive, and aerospace. To ensure effective and efficient thermal evaporation, high-purity metals and alloys are essential for achieving quality thin films. Indium Corporation is the preferred choice for customers, thanks to our advanced materials, unwavering commitment to quality, and outstanding technical support.

益处

Elevate Your Thin Film Deposition with Indium Corporation’s Premier Materials and Expertise

先进材料

We take pride in delivering top-tier metals, alloys, and compounds to ensure superior quality in thin film deposition.

卓越的铟

Indium and its compounds, especially indium tin oxide (ITO), are commonly used in displays, touchscreens, and solar cells because of their exceptional conductivity and transparency.

High-Quality Gallium

Gallium is instrumental in forming gallium arsenide (GaAs), a semiconductor known for its efficiency in converting electricity into light or radio frequency signals, making it essential in LED and radio frequency technology.

专用服务

我们与每位客户一起选择合适的材料，并提供我们在材料和工艺方面的专业知识，以确保无缝体验。

Materials and Available Forms

材料	圆形射击	泪滴镜头	大块	自定义表格	坩埚填充	定制坩埚插件
在	X	X		X	X	X
ITO			X
加	X				X
InGa	X	X		X	X

特点

Physical Properties of Common Elements for Thermal Evaporation

	铟	镓（Ga）	铜	硒
Atomic Number	49	31	29	34
沸点	2,072°C	2,204°C	2,562°C	685°C
熔点	157°C	29.8°C	1,084°C	221°C
Density	7.31 克/立方厘米	6.10 克/立方厘米	8.94 克/立方厘米	4.28 – 4.81g/cm³
Atomic Weight	114.8 克/摩尔	69.7 克/摩尔	63.5 克/摩尔	789.6 克/摩尔

Physical Properties for Common Alloys for Thermal Evaporation

	ITO	铜镓合金	Culn
熔点	1500°C	460°C	575°C
Density	7.16 克/立方厘米	7.91 克/立方厘米	8.45 克/立方厘米