应用
MEMS
In semiconductor packaging, Micro-Electro-Mechanical Systems (MEMS) devices are often integrated to enhance electronic systems with sensing and actuation capabilities. These compact, integrated units are widely used across numerous applications and markets. Ensuring high-quality assembly of MEMS devices is crucial for the performance and reliability of the final product. Indium Corporation offers a range of products designed to effectively meet these assembly needs.
概述
Achieve Precision, Protection, and Performance in MEMS
Packaging MEMS devices poses challenges in securing enclosures, lid seals, and mechanical stability. Precise electrical and mechanical integration is essential, and innovative soldering materials, like solder paste and flux, are key to ensuring reliability. We provide materials and expertise to address precision, protection, sealing, and performance needs for MEMS.
MEMs Assembly Products
Indium Corporation’s materials and expertise help eliminate defects in the design of the materials to reduce blow holes or solder creep.
Fine Powder Pastes
Semiconductor Solder Pastes Fine Powder Solder Pastes…
焊球
Select specialty semiconductor solder spheres ranging in…
半导体助焊剂
涵盖经实践验证和新型半导体产品的广泛产品组合……
合金
我们在合金 拥有数百名专业人士……
AuLTRA® ThInFORMS®
AuLTRA® ThInFORMS®：适用于芯片的理想预成型件，可提升……
AuLTRA®精密芯片 焊片
基于金（Au）的精密芯片 焊片 一流的精度……
金（Au）合金
一种用于精密应用的耐用、高性能金（Au）合金 。
相关应用
半导体封装和装配
关键的半导体封装确保了功能性和耐久性。
系统级封装（SiP） 异构集成 （HIA）
System-in-package (SiP) and heterogeneous integration solutions
相关市场
MEMS are used in a variety of applications, including automotive systems, consumer electronics, medical devices, and industrial equipment.
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