
概述
实现微机电系统的精度、保护和性能
封装微机电系统器件在确保外壳、盖子密封和机械稳定性方面面临挑战。精确的电气和机械整合至关重要,而创新的焊接材料(如焊膏和助焊剂)则是确保可靠性的关键。我们提供材料和专业知识,以满足 MEMS 在精度、保护、密封和性能方面的需求。
微机电组装产品
铟公司的材料和专业知识有助于消除材料设计中的缺陷,从而减少吹孔或焊接蠕变。
相关应用
Back to the Basics: Flux
During my first few weeks as a Technical Support Engineer at Indium Corporation, Iresearched extensively and consulted with my team to find out when flux should be used and why it’s essential
Ramp-to-Peak: The First Thought in a Reflow Profile
Folks, I am working on a book with my Indium Corporation colleagues on tackling soldering defects in electronics.It is a follow up to our The Printed Circuits Assembler's Guide to Solder Defects.