应用
微机电系统组件
In semiconductor packaging, Micro-Electro-Mechanical Systems (MEMS) devices are often integrated to enhance electronic systems with sensing and actuation capabilities. These compact, integrated units are widely used across numerous applications and markets. Ensuring high-quality assembly of MEMS devices is crucial for the performance and reliability of the final product. Indium Corporation offers a range of products designed to effectively meet these assembly needs.
概述
实现微机电系统的精度、保护和性能
封装微机电系统器件在确保外壳、盖子密封和机械稳定性方面面临挑战。精确的电气和机械整合至关重要，而创新的焊接材料（如焊膏和助焊剂）则是确保可靠性的关键。我们提供材料和专业知识，以满足 MEMS 在精度、保护、密封和性能方面的需求。
微机电组装产品
Indium Corporation’s materials and expertise help eliminate defects in the design of the materials to reduce blow holes or solder creep.
细粉浆
Semiconductor Solder Pastes Fine Powder Solder Pastes…
焊球
Select specialty semiconductor solder spheres ranging in…
半导体通量
Extensive portfolio of proven and new semiconductor…
合金
Our alloy innovation with hundreds of specialized…
AuLTRA® ThInFORMS®
AuLTRA® ThInFORMS®: Ideal preform for die-attach, enhancing…
AuLTRA®精密模头连接预型件
Gold-based precision die-attach preforms deliver top-notch precision…
金合金缎带
Durable, high-performance gold-alloy ribbon for precision uses.
相关应用
半导体封装和装配
关键的半导体封装确保了功能性和耐久性。
系统级封装（SiP）与异构集成组装（HIA）
系统级封装（SiP）和异构集成解决方案
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