BGA 连接球

The ball-attach process can be considered a trivial step when creating an FCBGA or similar package, but the final soldering step can be rather complex. There are several variables that impact the

Derivation of the Weibull Graph Folks, Last time we introduced Weibull analysis. Let's now derive the relationships needed to calculate the slope, beta, and characteristic life, eta. F(t) is the

Solderspheres or solder spheres, or even solder balls: whatever you call them, Indium Corporation has been making them for years and has rightly acquired the reputation for doing whatever it takes to

I recently visited a customer to help optimize a flux-less indium soldering application. They admitted they needed flux but didn’t know 1) what to use, or 2) if there was a better way to fix

This is the shape of flux deposits left after pin transfer Spheres attached after pin transfer Pin transfer is a way of selectively depositing a semi-solid or liquid material (like a solder paste or

Package-on-Package solder paste is a relatively new concept in the solder industry. With limited material sets, we need to be able to capitalize on the flexibility of the few solder pastes that are

Patty had to admit that the last few weeks were exciting. Her talk to US Army Rangers and Navy Seals on critical thinking went really well. Now, the local newspaper was asking her to comment on

Phil Zarrow: This video is for those in the electronics assembly industry that want to minimize the head-in-pillow defect. It includes the solder paste properties that help overcome this challenge.

朋友们，看来帕蒂和罗布又要去探险了。让我们来看看.....帕蒂从大学开始就一直开着那辆 2001 年产的萨博旅行车。它曾是一辆很棒的车，但是，随着时间的推移，它的性能越来越差。