产品 合金 液体合金

液体合金

在室温下保持液态的一系列合金。

技术支持:铟泰公司

  • 室温下为液体
  • High Thermal Conductivity
  • Non-Toxic, Gallium-Based Materials
一个瓶子将液态金属 灰色表面上的一個小金属液态金属 。

Indium Corporation’s range of liquid alloys is based on gallium and its alloys formed with Indium and Tin. As the Indium and Tin content varies, different melt behaviors are achieved as seen in the chart below.

Indalloy®51E is a eutectic composition of 66.5Ga/20.5In/13Sn with a melting point of 11°C

Liquid alloys enable these applications, not only because of their ultra-low melting points, but also because of their additional properties. These alloys can wet to surfaces such as glass and polymers. Gallium also forms an amalgam with most common metals. However, it does not dissolve refractory metals, which have very high melting points.

Liquid gallium rapidly forms a skin of oxidized metal on its surface; this effect is being utilized in many liquid metal technologies. Liquid metals can be utilized in printable solutions and can be embedded in elastomers to act as antennas and sensors. It is also important to note that gallium dissolves aluminum, which precludes its use with heat-sinks made from aluminum, for example.

Alloy/MetalIndalloy®#Ga%英寸Sn%共晶Solidus (°C)Liquidus (°C)
14100-29.8 (MP)29.8 (MP)
Ga/In77955没有1525
Ga/In60E792115.715.7
Ga/In/Sn5162.521.516没有1117
Ga/In/Sn51E66.520.5131111
Ga/In/Sn/Zn46L6125131没有78

产品数据表

液态金属 镓(Ga) 镓(Ga) PDS 97826.pdf
液态金属 PDS 99939 R2.pdf
LMP液态金属 PDS 100021 R3.pdf

相关应用

Liquid Alloys are suitable for a variety of applications.

正方形半导体芯片特写,绿色和黑色背景上有四个细分部分。

倒装芯片

A crucial technique in advanced semiconductor packaging.

SiP & Heterogeneous Integration Assembly (HIA)

系统级封装(SiP) 异构集成 (HIA)

System-in-package (SiP) and heterogeneous integration solutions

两名身着洁净室防护服的人员正在检查硅晶圆,确保高科技生产设施内的无焊剂焊接工艺达到最佳状态。

使用甲酸进行回流焊接

Flux-free solder pastes and materials for formic…

相关市场

Indium Corporation’s liquid alloys are available for use in a wide range of markets.

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