热管理
TIM1、TIM1.5 和 TIM2
Metal-based thermal interface material (TIM) solutions provide superior thermal performance and long-term reliability across multiple layers of the thermal stack. Whether using air cooling, direct liquid cooling, or immersion cooling, these TIMs can be tailored to meet specific thermal demands. Their ability to wet to a wide range of surfaces, combined with high isotropic thermal conductivity and low yield and flow strengths, allows them to conform to surface irregularities, effectively reducing overall thermal resistance (Rth).
概述
专业生产具有散热、可靠性和一致性优势的金属基 TIM
Indium Corporation leads the way in developing novel TIMs and processes for TIM1, TIM1.5, and TIM2 applications.
TIM1
Solders and liquid metals are used as high-performance TIMs between a semiconductor die and a package lid. Reflow and non-reflow solutions are available for LGA, PGA and BGA packages that see single or multiple reflow cycles.
TIM1.5
High-performance computing (HPC) applications require best-in-class TIM materials and process expertise. TIM1.5 (bare die lidless BGA packages) is the interface between a bare die and a heat-sink or cold plate and is often used in HPC design. Indium Corporation can help you choose between soldered, compressible, or liquid metal-based TIMs.
TIM2
TIM2 is the interface between a heat spreader or lid and a heat-sink. We typically recommend compressible TIMs, such as Heat-Spring®.
TIM1, TIM1.5, & TIM2 Products
焊接 TIM
Solder TIM solutions offer superior reliability and…
可压缩 TIM
Compressible TIMs for top thermal performance and…
液态金属和液态金属浆料
Liquid metals that are RoHS-compliant and non-toxic.
相变金属 TIM
Discover the advantages of PCMA TIMs over…
相关应用
半导体封装和装配
Critical semiconductor packaging ensures functionality and durability.
浸入式冷却
A technique on the rise for thermal…
SiP and Heterogeneous Integration Assembly (HIA)
系统级封装（SiP）和异构集成解决方案
热管理
Thermal solutions for HPC ensuring reliability and…
电力电子产品包装与装配
Extensive range of proven high-reliability solder and…
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