焊接^强化

Solder Fortification® preforms are flux-free rectangular alloyed metal pieces designed to enhance solder joints by seamlessly integrating with solder paste during reflow. Sharing the same alloy as the paste, they reflow together using the paste’s flux, ensuring optimal adhesion and flow. These preforms significantly increase solder volume, making them ideal for fine-pitch applications (0.3 mm or smaller) where robust, reliable connections are critical.

技术支持：铟泰公司

Stronger Solder Joints
Reduced Rework
焊接量增加

产品概览

Solder Fortification® preforms are packaged in tape & reel for easy placement by standard pick-and-place machines.

常见合金：

SAC305

SAC387

Sn63

Sn62

名称	尺寸	每卷数量 7英寸	每卷数量 13″	重量示例：SAC305（克/个）	SAC 305	锡铅
0201H	0.010″ x 0.020″ x 0.005″ (0.254 mm x 0.508 mm x 0.127 mm)	1,000	50,000	0.00012	✓	不适用
0201	0.010″ x 0.020″ x 0.010″ (0.254 mm x 0.508 mm x 0.254 mm)	1,000	50,000	0.00024	✓	✓
0402B	0.020″ x 0.040″ x 0.004″ (0.508 mm x 1.01 mm x 0.101 mm)	1,000	15,000	0.00039	✓	不适用
0402H	0.020″ x 0.040″ x 0.010″ (0.508 mm x 1.01 mm x 0.25 mm)	1,000	15,000	0.00096	✓	不适用
0402	0.020″ x 0.040″ x 0.020″ (0.508 mm x 1.01 mm x 0.48 mm)	1,000	15,000	0.00182	✓	✓
0603H	0.030″ x 0.060″ x 0.015″ (0.76 mm x 1.52 mm x 0.381 mm)	1,000	15,000	0.00325	✓	不适用
0603	0.030″ x 0.060″ x 0.030″ (0.76 mm x 1.52 mm x 0.787 mm)	1,000	15,000	0.00672	✓	✓
0805H	0.050″ x 0.080″ x 0.030″ (1.27mm x 2.03mm x 0.762mm)	1,000	10,000	0.01444	✓	不适用
0805	0.050″ x 0.080″ x 0.050″（1.27mm x 2.03mm x 1.27mm）	1,000	10,000	0.0241	✓	✓
1206	0.060″ x 0.120″ x 0.060″（1.52mm x 3.05mm x 1.52mm）	1,000	7,500	0.0521	✓	✓

特点

Achieving precise solder joints is essential for reliability in electronics manufacturing. However, miniaturization trends, such as reduced stencil thickness and tighter component spacing, make this increasingly complex. Solder Fortification® preforms provide an advanced solution to effectively meet these demanding requirements.

边缘连接器

Edge connectors endure frequent mechanical stress from plugging and unplugging, making durable solder joints essential for reliability. Adding solder preforms increases solder volume, creating stronger, more resilient joints to withstand repeated use.

Through-Hole Solder Joints

Through-hole solder joints can be costly with wave soldering, while solder paste alone may struggle to achieve complete hole fill. Adding solder preforms increases solder volume, improving strength and reliability, especially for servers, telecommunications, and automotive applications.

Quad-Flat No Lead (QFN) Void Reduction

Voiding under QFN components is a major thermal reliability challenge caused by volatiles in solder paste. Solder preforms, free of flux and volatiles, significantly reduce voiding, ensuring more reliable solder joints compared to paste alone.

射频屏蔽

RF shields require a complete solder joint to ensure they are securely attached to the board. Traditional stencil printing often falls short in delivering the necessary solder volume for a full joint around the shield. Adding solder preforms significantly increases solder volume, ensuring a reliable, robust connection compared to solder paste alone.