通量
半导体助焊剂
Indium Corporation is a leading innovator in semiconductor fluxes, offering a comprehensive range of proven and advanced solutions critical for forming reliable solder joints in semiconductor packaging. Our materials spearhead the production of durable, high-performance products designed to withstand physical shocks and thermal stresses common in electronic devices. From Internet of Things (IoT) and mobile devices to low-energy servers and automotive electronics, our fluxes help ensure strength and reliability across a wide range of applications.
技术支持：铟泰公司
- Leader in Ultra-low Residue, No-clean Flux
- Easy-to-clean Water-wash Formulas
- 强大的技术专长
产品概览
The primary role of flux is to remove oxides and impurities from soldering surfaces, enabling proper wetting of the solder and ensuring strong, reliable connections that maintain the integrity and functionality of semiconductor packages. Our diverse portfolio includes both flux and flux-less solutions, offering water-wash and no-clean options to meet the needs of various applications, from ball-attach to flip-chip and more.
特点
证明
Wafer bumping flux WS-3401 and flip-chip flux WS-641 are widely applied in 2.5D and advanced semiconductor assembly.
卓越先锋
As developers of the first ultra-low residue flux, we have remained at the forefront of innovation with a wide range of advanced ultra-low residue solutions. These fluxes enable a true no-clean process, promoting sustainability by eliminating the need for cleaning chemicals and significantly reducing water and energy consumption, all while lowering operational costs.
一步式
Water-washable ball-attach and flip-chip flux WS-446HF has demonstrated outstanding performance on Cu-OSP, streamlining the process by eliminating extra cleaning steps that typically involve additional flux to remove excessive oxides. A one-step Cu-OSP process enhances efficiency.
相关应用
Semiconductor Fluxes are available to use in a wide range of applications.
相关市场
Our materials contribute to the production of robust, reliable products that can endure the physical impacts and thermal stresses typical of electronic devices. Whether it’s for IoT mobile devices, high-performance computing, or automotive electronics, our solutions ensure durability across a range of demanding applications.
专家支持，结果可靠
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