产品
烧结材料
Sintering in electronics assembly, is a bonding technique where high melting temperature metals such as silver or copper are used to form highly reliable interconnects with superior thermal and electrical conductivity. Sintering is a process of steady-state interdiffusion, the metal particles fuse together and fuse with the surfaces being bonded once sufficient heat is applied. Sintering can be performed pressure-less or with applied pressure. Indium Corporation offers both silver and copper sinter pastes for both pressure and pressureless processes.
技术支持：铟泰公司
- 有压和无压配方
- Pure Sinter Materials (No Epoxy or Polymer)
- 高金属、低有机物方法
烧结产品
Indium Corporation provides a range of sinter pastes tailored for various applications. The InFORCE® series is optimized for pressure sintering, while the InBAKE™ series is ideal for traditional pressureless sintering. For fast, small-area sintering, the QuickSinter® series delivers exceptional performance, ensuring rapid and efficient results.
InFORCE®
InFORCE® 系列烧结 在高性能方面表现卓越……
InBAKE™
Pressureless sinter pastes for traditional batch oven…
QuickSINTER
将小型模具的烧结时间缩短至…
相关应用
专家支持，结果可靠
您有技术问题或销售咨询吗？我们的专业团队随时为您提供帮助。From One Engineer to Another®不仅是我们的一句口号，更是我们致力于提供卓越服务的承诺。只要您需要，我们随时待命。让我们联系吧！
寻找安全数据表？
您所需的一切——从技术规格到应用 ——都可在此一站式获取。
您的成功
是我们的目标
借助最新的材料、技术以及专家应用 优化您的生产流程。一切都始于与我们团队的联系。