烧结材料

Sintering in electronics assembly, is a bonding technique where high melting temperature metals such as silver or copper are used to form highly reliable interconnects with superior thermal and electrical conductivity. Sintering is a process of steady-state interdiffusion, the metal particles fuse together and fuse with the surfaces being bonded once sufficient heat is applied. Sintering can be performed pressure-less or with applied pressure. Indium Corporation offers both silver and copper sinter pastes for both pressure and pressureless processes.

由铟公司提供

有压和无压配方
纯烧结材料（无环氧树脂或聚合物）
高金属、低有机物方法

烧结产品

Indium Corporation 为各种应用提供一系列烧结浆料。^InFORCE®系列针对压力烧结进行了优化，而 InBAKE™ 系列则是传统无压烧结的理想选择。对于快速、小面积烧结，QuickSinter® 系列具有卓越的性能，可确保快速、高效的烧结效果。

标有 "QuickSinter InFORCE MF Pressure Ag Sinter Paste "的白色罐子，由 Indium Corporation 生产。

专家支持，结果可靠

您有技术问题或销售咨询吗？我们的专业团队将竭诚为您服务。"从一个工程师到另一个工程师®"不仅是我们的座右铭，也是我们提供卓越服务的承诺。我们随时准备为您服务。让我们联系起来！

获取支持

该图片的 alt 属性为空；文件名为 scientist-with-microscope.png

白皮书

产品

The Surge of Cu Sinter Paste

A little over a year ago, I posted about the increase in interest regarding Cu sintering. In the past 12 months, that interest has has surged, highlighting Cu sintering's suitability for various

查看帖子

产品