產品

燒結材料

Sintering in electronics assembly, is a bonding technique where high melting temperature metals such as silver or copper are used to form highly reliable interconnects with superior thermal and electrical conductivity. Sintering is a process of steady-state interdiffusion, the metal particles fuse together and fuse with the surfaces being bonded once sufficient heat is applied. Sintering can be performed pressure-less or with applied pressure. Indium Corporation offers both silver and copper sinter pastes for both pressure and pressureless processes.

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• 有壓和無壓配方
• 純燒結材料（不含環氧樹脂或聚合物）
• 高金屬、低有機物方法