低溫焊接

Low-temperature soldering has surged in popularity, driven by increasing technical and manufacturing challenges and a strong emphasis on sustainability. The industry is increasingly focused on developing alloys and processes tailored to diverse low-temperature needs. At Indium Corporation, we’re transforming the electronics manufacturing landscape with our innovative suite of low-temperature soldering materials and decades of expertise in low-temperate applications.

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概述

Enhancing Performance with Sustainable Solutions

Low-temperature soldering offers both technical and environmental benefits. It helps reduce thermal stress, advance technology for complex designs, and eliminate heat-induced defects like warpages or damage to sensitive components. At the same time, it lowers energy costs and reduces carbon emissions, aligning with environmental regulations and supporting our customers’ sustainability goals.

Low-Temperature Soldering Applications

Attachment to Circuit Boards

Attachment of temperature-sensitive components to printed circuit boards.

Step Soldering

Step soldering, when a secondary, lower temperature reflow process is required after a standard SAC soldering process is completed.

Eliminate Warpage

Eliminating warpage of thinner chips due to high-temperature reflow.

IoT Devices

Low melting or low-Tg flex circuitry which are used in cellphones, smartwatches, and many internet-of-things (IoT) devices.

Large Area Array Devices

Large area array devices – such as BGAs – to avoid head-in-pillow (HIP) and non-wet-open (NWO) failures.

Low-Temperature Soldering Products

Discover our diverse portfolio of solders, including traditional indium- and bismuth-based alloys, as well as the innovative Bi+ and Durafuse® LT series, designed to meet advanced requirements.