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In a previous post I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram. This tool helps map out a process and provide an

The tremendous increase in the use of bottom terminated components (BTCs), some estimates are at more than 50 billion per year, have heightened the concern for minimizing voiding between the thermal

Phil Zarrow: Brook, we've discussed handling solder paste from the refrigerator to the stencil printer, but there's a lot more to this story, particularly from the factory to the customer.

Although Au/Sn solder performs like a braze in service, it can also be processed as a solder using flux. There is a caveat – not all fluxes can handle the high processing temperature required

無助焊剂焊接通常被認為是困難的，甚至是不可能的。然而，80Au/Sn 焊帶和預型件通常都採用無助焊剂製程 - 這怎麼可能呢？簡單的答案是

The copper coupon is a pretty simple test. A given amount of solder is reflowed onto a copper coupon with a specified amount of each flux. The test can be performed on either lead-free solder or

The Alchemist (WF-9955) applies her sophisticated understanding of wave soldering flux ingredients and their interactions with metallizations to defeat Oxide, while at the same time effectively

Phil Zarrow: This is part one of a three-part series. This video is for anyone interested in design of experiment aspect of Avoid the

This video is for electronics assembly professionals who are looking to improve their wave soldering processes. It includes tools and resources that will help overcome common challenges. Phil Zarrow: