2.5D 與 3D 包裝

當然，球接製程並不如其他製程那麼令人興奮，例如倒裝晶片組裝、2.5D 與 3D 製程。

As the semiconductor packaging technology evolves in the “More than Moore” era, many advanced processes have presented challenges in manufacturing. Often, challenges in precision die bonding, for

先進封裝持續演進，各種互連技術正朝著異質化的方向發展。

Thermal management is becoming an ever more critical challenge for semiconductor devices, as the functional density and power density increase – especially with advanced packaging. Thermal test

在 Indium Corporation 擔任技術支援工程師的最初幾週，我進行了廣泛的調查研究，並與團隊商討，以釐清何時應使用助焊劑，以及為何這對……至關重要

Folks, I am working on a book with my Indium Corporation colleagues on tackling soldering defects in electronics.It is a follow up to our The Printed Circuits Assembler's Guide to Solder Defects.