半导体封装与装配
2.5D 和 3D 包装
To boost performance, integration, and system capabilities in semiconductor devices, the industry is increasingly adopting 2.5D and 3D packaging. This consolidates multiple integrated circuits (ICs) into a single package, a crucial trend in miniaturization during an era of heterogeneous integration. As a global leader in designing, formulating, manufacturing, and supplying semiconductor-grade fluxes, pastes, and related materials, Indium Corporation is the proven expert for your packaging needs.
概述
利用 2.5D 和 3D 封装技术推进半导体集成
More than Moore, 2.5D and 3D packaging are sophisticated semiconductor integration technologies aimed at enhancing performance and system capabilities. These techniques enable the incorporation of diverse process nodes into a single package. In 2.5D packaging, dies are positioned side by side, while 3D packaging involves stacking the dies vertically. Indium Corporation collaborates with top-tier customers and equipment partners to innovate and refine materials and assembly processes in this rapidly evolving realm.
益处
通过战略合作推动包装材料创新
战略合作伙伴
Leading customers and equipment partners help Indium Corporation develop cutting-edge materials tailored for advanced packaging requirements.
证明
经过工艺验证的材料已用于先进的包装装配。
高收益
我们的材料坚固稳定，可实现理想的产量，特别是在具有挑战性的包装装配工艺中。
卓越的技术服务
我们为您提供选择材料和优化工艺所需的支持，以实现高产。
相关产品
Indium Corporation provides a comprehensive range of materials tailored to meet the demands of 2.5D and 3D packaging solutions.
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相关应用
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A crucial technique in advanced semiconductor packaging.
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