应用
包装-附件
To manage thermal load in power electronics systems, it’s essential to integrate the power module packaging with an effective cooling system. As mission profiles push for higher operating temperatures and power densities—especially in electric vehicle (EV) applications—designing the interface between the package and cooler becomes a critical factor. Key considerations when selecting materials for this package-to-cooler connection include thermal conductivity, mechanical strength, processing temperature, and lifecycle performance.
概述
通过套装附件材料提供合适的解决方案
With a broad range of power module packaging, cooling system designs, and mission profiles, there is no one-size-fits-all package-attach alternative. From sinter pastes and InFORMS® solder preforms to Heat-Spring® thermal interface materials, Indium Corporation delivers solutions that balance performance, scalability, and cost-effectiveness.
益处
动力组件附件的全面组合
Superior Thermal Reliability
Indium Corporation’s metal-based thermal interface materials deliver a significant improvement over traditional organic options, offering up to 10 times higher thermal conductivity and reduced thermal resistance. Thermal conductivity ranges from over 40 W/mK with solder preforms to as high as 250 W/mK with sinter pastes.
Excellent Mechanical Reliability
Our materials offer robust mechanical properties to prevent fatigue and premature lifecycle failures, such as InFORCETM LA sintering technology, designed to tackle the challenges of extreme mission profiles.
经过验证、可扩展且可靠
We leverage extensive experience in manufacturing solder preforms, pastes, and thermal interface materials for a variety of industries.
可降低加工温度
Innovative alloy technology, such as Indalloy®301 LT, limits the thermal exposure of packaging during manufacturing, preventing internal delamination and warpage to extend system life.
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InFORCE®
InFORCE® 系列烧结 在高性能方面表现卓越……
Indalloy®301LT
Indalloy® 301LT 提供多种焊料形态及……
热泉
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相关应用
电力电子产品包装与装配
种类齐全、经过验证的高可靠性 和……
热管理
面向高性能计算（HPC）的散热解决方案，确保可靠性
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