避免^虚空

Avoid the void and prevent shortened product life, field failures, and customer dissatisfaction with Indium Corporation’s advanced solder paste technology. Our range of solders is formulated to minimize voiding and provide enhanced benefits to address additional process needs, including improved response-to-pauses, stability, reduced head-in-pillow (HiP) defects, reliable in-circuit testing, and superior surface insulation resistance (SIR) performance.

技术支持：铟泰公司

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概述

Avoid the Void^® with Indium Corporation’s Advanced Solders

Our Avoid the Void® initiative tackles one of the most critical challenges in electronic assembly: minimizing voiding in solder joints. This approach highlights our commitment to delivering high-quality, reliable soldering solutions by offering solder pastes specifically designed to reduce voiding, optimize processes, and enhance techniques. By collaborating closely with industry partners and customers worldwide, we provide proven and innovative solutions to address this increasingly challenging defect.

益处

Maximize Performance, Reliability, and Yield

Enhanced Reliability

With Avoid the Void®, electronic assemblies achieve enhanced mechanical and thermal stability, minimizing the risk of joint failures under stress.

提高性能

Achieve better heat dissipation and electrical conductivity with fewer voids, ensuring optimal performance in demanding applications.

高效制造

By optimizing solder paste formulations, reflow profiles, and processes, Avoid the Void® streamlines manufacturing, reduces rework, and boosts production yields.

降低拥有成本

Avoid the Void® delivers improved performance, enhanced reliability, and higher yields, enabling customers to lower their cost of ownership while meeting industry quality standards.

Avoid the^Void®焊膏

Many of our solder pastes are designed to reduce voiding while providing other benefits. Our best-selling Indium8.9HF Series provides many low-voiding options such as Indium8.9HFRV, a new formula specifically designed for high-reliability alloys.

焊片

We have many solder preform products that can help reduce voiding, led by the flux-coated preform LV series.

多年的专业知识

Our resource library offers a wealth of resources, including papers, literature, webinars, videos, and blogs on voiding and strategies to reduce it, helping our customers overcome this challenge.