热界面材料
焊接 TIM (sTIM)
High-power density devices demand top-tier thermal interface materials. Indium Corporation’s sTIMs meet the reliability, thermal, and warpage requirements of high-performance devices. As the leading global provider of sTIM solutions, we offer expertise in integrating sTIMs into your process, backed by our skilled engineers and trusted equipment partners.
技术支持：铟泰公司
- 高度自动化的全球生产基地与稳定的长期供应链
- Advanced Quality Controls Essential for Meeting Semiconductor Industry Standards
- Global Network of Expert Technical Support
产品概览
High Thermal Conductivity
Indium has a high bulk thermal conductivity (86 W/mK), which means less sensitivity to bondline thicknesses and coplanarity issues compared to polymer-based TIMs.
TIM1 和 TIM1.5 sTIM 解决方案
Indium and indium-based alloys are available for single and multiple reflow processes, designed for maximum wetting to various metallizations with minimal voiding.
长期可靠性
We’ll help you design and adopt a package architecture that ensures thermal and mechanical reliability to overcome both overheating and warpage.
High-Performance
Our sTIMs deliver the lowest total thermal resistance in the industry.
Manufactured Globally
Our manufacturing capabilities ensure high-quality product availability at scale across the globe.
可持续发展
We source our materials reliably and responsibly and offer reclaim and recycle programs.
产品数据表
铟基焊料热界面材料 PDS 100407 R0
用于 BGA 封装的焊接热界面材料 PDS 100082 R1.pdf
相关应用
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热泉
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液态金属 液态金属
符合RoHS标准且无毒的液态金属。
相变型金属TIMs（TIMs）
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焊料合金
种类繁多的焊料合金，其熔点……
专家支持，结果可靠
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