热界面材料
焊接 TIM (sTIM)
High-power density devices demand top-tier thermal interface materials. Indium Corporation’s sTIMs meet the reliability, thermal, and warpage requirements of high-performance devices. As the leading global provider of sTIM solutions, we offer expertise in integrating sTIMs into your process, backed by our skilled engineers and trusted equipment partners.
由铟泰公司提供支持
- 高度自动化的全球生产基地与稳定的长期供应链
- Advanced Quality Controls Essential for Meeting Semiconductor Industry Standards
- Global Network of Expert Technical Support
产品概览
高导热性
Indium has a high bulk thermal conductivity (86 W/mK), which means less sensitivity to bondline thicknesses and coplanarity issues compared to polymer-based TIMs.
TIM1 和 TIM1.5 sTIM 解决方案
铟和铟基合金可用于单回流焊和多回流焊工艺，设计用于最大限度地润湿各种金属化，同时将空隙降至最低。
长期可靠性
We’ll help you design and adopt a package architecture that ensures thermal and mechanical reliability to overcome both overheating and warpage.
High-Performance
Our sTIMs deliver the lowest total thermal resistance in the industry.
Manufactured Globally
Our manufacturing capabilities ensure high-quality product availability at scale across the globe.
可持续发展
We source our materials reliably and responsibly and offer reclaim and recycle programs.
产品数据表
Indium-Based Solder Thermal Interface Materials PDS 100407 R0
用于 BGA 封装的焊接热界面材料 PDS 100082 R1.pdf
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