产品 Rel-ion

Rel-ion® Family of Products

Rel-ion™ 徽标

Driving e-Mobility with Indium Corporation’s Rel-ion® Products

E-Mobility is the future. The number of electric vehicles on roads worldwide is surging, and this growth will continue as governments, manufacturers, and suppliers embrace electrification. Explore Indium Corporation’s cutting-edge high-reliability soldering and thermal interface material solutions, along with our industry insights, to navigate this rapidly evolving market.

功能与优点

用于电动汽车的可靠、可扩展且经过验证的焊料和热界面材料

全球技术支持

我们在全球范围内提供一流的现场支持,确保您的供应链无缝运行。

稳定的供应链

我们的全球足迹与可靠的供应链战略相结合,包括一项应急恢复计划,以确保连续性和复原力。

质量保证

Indium Corporation products and manufacturing processes meet stringent standards, including IATF (PPAP), HKMC MS184-1, and AQC 324 requirements.

经过市场检验

As of 2024, more than 20 million electric vehicles on the road include Indium Corporation’s Rel-ion® suite of products—and that figure is growing every year. Our proven products deliver reliability with zero km failures for modules, components, and systems.

半导体级解决方案

Indium Corporation offers a suite of fluxes and semiconductor-grade solder pastes designed to enhance yields and ensure material compatibility for a wide range of applications, including SoC, GPUs/CPUs, SiP, DDR, AI accelerators, and more.

PCBA 级解决方案

我们提供大量的焊膏和高可靠性合金,如 Durafuse® 技术,可满足更长的任务曲线、更高的工作温度和更长的热循环要求。

电源模块级解决方案

从我们的专利增强预成型技术 InFORMs® 到银和铜烧结浆料,我们为电动汽车用电力电子产品中的芯片贴装到封装贴装应用提供了广泛的解决方案。

专家支持

Indium Corporation has positioned itself as a thought leader in this rapidly growing market by collaborating with industry experts, leading key committees, and sharing insights through our renowned webinar series, EVInSIDER Live and InSIDER Series.

相关应用

印刷电路板上的微型芯片

PCB 组装

经过验证且前沿的PCB组装材料……

一辆未来感十足的白色跑车,搭载着先进的电力电子系统,在霓虹灯照亮的夜色中疾驰穿梭,展现着尖端的速度与科技。

电力电子产品包装与装配

种类繁多的久经考验的高可靠性焊料及……

具有网格状结构和反射光泽的彩色图案微型芯片表面特写。

半导体封装和装配

关键的半导体封装确保了功能性和耐久性。

相关市场

寻找安全数据表?

从技术规格到应用指南,您可以在一个方便的位置获得所需的一切。