Applications Semiconductor Packaging and Assembly Reflow Soldering with Formic Acid

使用甲酸进行回流焊接

Formic acid is a carboxylic acid with the chemical formula HCOOH. When heated to temperatures ≥ 180oC, formic acid “activates” to become a very efficient reducing agent of metal oxides. When formic acid is utilized in reflow soldering, a flux is no longer necessary. Formic acid reflow with the addition of vacuum ensures a true no-clean process with ultra-low voiding and reduced environmental impact compared to traditional reflow soldering thanks to the removal of the cleaning step and the associated waste produced.


Innovative Material for Critical Applications

Virtually Zero Residue

After reflow, almost all of the material is evaporated off, leaving only a clean solder joint.

无需清洁

降低化学成本和减少工艺步骤有助于实现可持续发展目标。

增强兼容性

No residue means no compatibility concerns about flux residue compatibility with underfill or molding materials.

消除电化学迁移

只使用完全蒸发的良性化学品,消除了 ECM 的风险。

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