应用
使用甲酸进行回流焊接
Formic acid is a carboxylic acid with the chemical formula HCOOH. When heated to temperatures ≥ 180oC, formic acid “activates” to become a very efficient reducing agent of metal oxides. When formic acid is utilized in reflow soldering, a flux is no longer necessary. Formic acid reflow with the addition of vacuum ensures a true no-clean process with ultra-low voiding and reduced environmental impact compared to traditional reflow soldering thanks to the removal of the cleaning step and the associated waste produced.

概述
Revolutionize with Flux-free Materials for Formic Acid Reflow
Formic acid soldering is a cutting-edge technology within the power electronics assembly space, that enables the creation of clean, low-void solder joints without the use of a traditional flux. Indium Corporation is at the forefront of developing high purity, flux-free solders specifically for the formic acid soldering application. The FAST (Formic Acid Soldering Technology) family of products include preforms, InTACK® tacking agent and the novel flux-less FAST Paste.
益处
Innovative Material for Critical Applications
Virtually Zero Residue
After reflow, almost all of the material is evaporated off, leaving only a clean solder joint.
无需清洁
降低化学成本和减少工艺步骤有助于实现可持续发展目标。
增强兼容性
No residue means no compatibility concerns about flux residue compatibility with underfill or molding materials.
消除电化学迁移
只使用完全蒸发的良性化学品,消除了 ECM 的风险。
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