Applications Semiconductor Packaging and Assembly Reflow Soldering with Formic Acid

使用甲酸进行回流焊接

Formic acid is a carboxylic acid with the chemical formula HCOOH. When heated to temperatures ≥ 180oC, formic acid “activates” to become a very efficient reducing agent of metal oxides. When formic acid is utilized in reflow soldering, a flux is no longer necessary. Formic acid reflow with the addition of vacuum ensures a true no-clean process with ultra-low voiding and reduced environmental impact compared to traditional reflow soldering thanks to the removal of the cleaning step and the associated waste produced.

Exploded view of a power semiconductor module with copper terminals, chips, and a base plate.

Innovative Material for Critical Applications

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Virtually Zero Residue

After reflow, almost all of the material is evaporated off, leaving only a clean solder joint.

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无需清洁

降低化学成本和减少工艺步骤有助于实现可持续发展目标。

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增强兼容性

No residue means no compatibility concerns about flux residue compatibility with underfill or molding materials.

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消除电化学迁移

只使用完全蒸发的良性化学品,消除了 ECM 的风险。

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关键的半导体封装确保了功能性和耐久性。

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