甲酸回流焊接

Formic acid is a carboxylic acid with the chemical formula HCOOH. When heated to temperatures ≥ 180^oC, formic acid “activates” to become a very efficient reducing agent of metal oxides. When formic acid is utilized in reflow soldering, a flux is no longer necessary. Formic acid reflow with the addition of vacuum ensures a true no-clean process with ultra-low voiding and reduced environmental impact compared to traditional reflow soldering thanks to the removal of the cleaning step and the associated waste produced.

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概述

使用无助焊剂材料实现甲酸回流焊的革命性变革

Formic acid soldering is a cutting-edge technology within the power electronics assembly space, that enables the creation of clean, low-void solder joints without the use of a traditional flux. Indium Corporation is at the forefront of developing high purity, flux-free solders specifically for the formic acid soldering application. The FAST (Formic Acid Soldering Technology) family of products include preforms, InTACK® tacking agent and the novel flux-less FAST Paste.

益处

用于关键应用的创新材料

几乎零残留

回流焊后，几乎所有材料都会蒸发掉，只留下干净的焊点。

无需清洁

降低化学成本和减少工艺步骤有助于实现可持续发展目标。

增强兼容性

无残留意味着无需担心助焊剂残留物与底层填充物或成型材料的兼容性问题。

消除电化学迁移

只使用完全蒸发的良性化学品，消除了 ECM 的风险。

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为封装系统开发创新型先进封装材料

先进封装技术不断发展，各种互连技术正朝着异构化的方向迈进。

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我们美国人是 "公制思维 "吗？

各位，我在阅读 BBC 的《科学聚焦》杂志时，看到了 10 月刊第 12 页上的一封读者致编辑的信："阅读关于聚变发电的问答

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粘度与粘性

粘度和粘性是定义助焊剂的两个重要材料特性。人们常常把它们 "粘 "在一起，认为它们是相辅相成的。通常情况下是这样，但并非如此。

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IPC J-STD-004A 和 J-STD-004B 之间有何变化？

两个测试的主要区别之一是温度和湿度。IPC J-STD-004A 的测试温度为 85°C，相对湿度为 85%，而 J-STD-004B 的测试温度为 85°C，相对湿度为 85%。

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焊料预型件 - 现在比以往任何时候都更加重要

Indium Corporation has been making solder preforms for a long, long time.Solder preforms may have been in your first transistor radio (for those of us experienced enough to remember such a

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