Applications Semiconductor Packaging and Assembly Reflow Soldering with Formic Acid

Reflow Soldering with Formic Acid

Formic acid is a carboxylic acid with the chemical formula HCOOH. When heated to temperatures ≥ 180oC, formic acid “activates” to become a very efficient reducing agent of metal oxides. When formic acid is utilized in reflow soldering, a flux is no longer necessary. Formic acid reflow with the addition of vacuum ensures a true no-clean process with ultra-low voiding and reduced environmental impact compared to traditional reflow soldering thanks to the removal of the cleaning step and the associated waste produced.

Exploded view of a power semiconductor module with copper terminals, chips, and a base plate.

Innovative Material for Critical Applications

A green circular icon with a white checkmark.

Virtually Zero Residue

After reflow, almost all of the material is evaporated off, leaving only a clean solder joint.

A green circular icon with a white checkmark.

No Cleaning Necessary

Reduced chemical costs and fewer process steps help contribute to sustainability goals.

A green circular icon with a white checkmark.

Enhanced Compatibility

No residue means no compatibility concerns about flux residue compatibility with underfill or molding materials.

A green circular icon with a white checkmark.

Eliminate Electrochemical Migration

Only benign chemicals that fully evaporate are used, eliminating the risk of ECM.

Related Applications

Futuristic white car with advanced power electronics zips through a neon-lit city at night, showcasing cutting-edge speed and technology.

Power Electronics Packaging & Assembly

Extensive range of proven high-reliability solder and…

Close-up of a colorful patterned microchip surface with a grid-like structure and a reflective sheen.

Semiconductor Packaging and Assembly

Critical semiconductor packaging ensures functionality and durability.

Related Markets