Indium Corporation Honored as Global Leader in ‘Solder and Materials’ with BETA Award
Indium Corporation was awarded one of BISinfotech’s coveted 2021 BETAs (BISinfotech Excellence and Technovation Awards) as a global leader in the Solder and Materials category during a virtual ceremony on Nov. 30. November 2021.
Mexico EMS - Mexico Technology Award: (Flux Cored Wire)
Indium Corporation earned a Mexico Technology Award for CW-232 , its low-spatter, flux-cored wire for robotic soldering during an award ceremony on Nov. 3 at SMTA International in Minneapolis, MN, USA. November 2021.
Electronics Assembly Materials Innovation of the Year Award: (Durafuse ™ LT)
Indium Corporation earned Electronics Maker ’s Electronics Assembly Materials Innovation of the Year award for its patent-pending Durafuse™ LT alloy technology. Electronics Maker’s Best of Industry Awards celebrate excellence in the Indian electronics market. They aim to honor and recognize the leading performers and innovators in the electronics industry for demonstrating leadership, product innovation, excellence in their field, and effectiveness in addressing a need or defining a new market. October 2021
Circuits Assembly New Product Introduction Award 2021: (Flux Cored Wire)
Indium Corporation has earned the Circuits Assembly New Product Introduction (NPI) Award for its new flux-cored wire for robotic and laser soldering. The award was presented on Tuesday, April 6 during a virtual ceremony. April 2021.
Circuits Assembly’s Service Excellence Award
Indium Corporation was honored with Circuits Assembly’s Service Excellence Award for a materials company at the IPC APEX Expo. The Service Excellence Award recognizes electronics companies that, as judged by their own customers, demonstrate the highest performance across the areas of Technology, Responsiveness, Dependability, Quality, and Value for Price. February 2017.
EM World's Innovation Award: (Flux Cored Wire)
Indium Corporation earned Electronics Manufacturing (EM) World's Innovation Award for its new flux-cored wire for robotic and laser soldering. The award was presented on Thursday, March 18 in Shanghai, China, during Productronica China. March 2021.
Mexico Technology Award : (Durafuse™ LT)
Indium Corporation was presented with the Mexico Technology Award, sponsored by Mexico EMS, for its Durafuse™ LT alloy technology. The award program recognizes the best electronics manufacturing innovations in the electronics manufacturing industry in Mexico produced by OEM manufacturing equipment and materials suppliers over the last year. October 2020.
Electronics Manufacturing (EM) Innovation Award: (Durafuse™ LT)
Indium Corporation was presented with the Electronics Manufacturing (EM) Innovation Award for its Durafuse™ LT alloy technology. The award program recognizes and celebrates excellence in the electronics industry, encouraging companies to achieve the highest standards and push the industry forward. July 2020.
CIRCUITS ASSEMBLY New Product Introduction (NPI) Award: (Durafuse™ LT)
Indium Corporation was presented with the CIRCUITS ASSEMBLY New Product Introduction (NPI) Award for its Durafuse™ LT alloy technology at the IPC APEX EXPO technical conference. The NPI Awards recognize the leading new products for electronics assembly during the previous year. Honorees are selected by an independent panel of practicing engineers. February 2020.
Best Paper Award: (Dr. Ning-Cheng Lee and Dr. Min Yao)
Dr. Ning-Cheng Lee, Vice President of Technology, and Dr. Min Yao earned a Best Paper Award during the International Microsystems, Packaging, Assembly, and Circuits Conference (IMPACT) 2018 for their paper Nano-Cu Sintering Paste for High Power Devices Die-Attach Applications. October 2018.
Best Paper Award: (Mary Ma)
Mary Ma, Research Chemist, earned the “Best Paper” award at the SMTA China East Technology Conference 2018 for her paper titled Sn3.2Ag0.7Cu5.5Sb Solder Alloy with High Reliability Performance up to 175°C. April 2018.
SMTA Corporate Partnership Award
Indium Corporation was presented with the prestigious SMTA Corporate Partnership Award during SMTA International 2018. Indium Corporation was also presented with the SMTA Expo Participation Award. October 2018.
Electronics Manufacturing (EM) Asia Innovation Award: (Indium10.1HF)
Indium Corporation was presented with the Electronics Manufacturing (EM) Asia Innovation Award for its Indium10.1HF Solder Paste during NEPCON China. The award program recognizes and celebrates excellence in the Asian electronics industry, encouraging companies to achieve the highest standards and push the industry forward. May 2018.
SMT China Vision Award: (Indium10.1HF)
Indium Corporation was presented with the SMT China Vision Award for its Indium10.1HF Solder Paste during NEPCON China. The SMT China Vision Award recognizes domestic and international companies with innovative products and technologies in SMT methods, processes, materials, equipment, software, and management services. April 2018.
ON Semiconductor Award
Indium Corporation was presented with the ON Semiconductor Award for its “perfect quality.” Indium Corporation, one of more than 3,000 ON Semiconductor production suppliers, was selected for its commitment to ensuring high quality and supply continuity in an evolving semiconductor market. April 2018.
CIRCUITS ASSEMBLY New Product Introduction (NPI) Award: (Core 230-RC)
Indium Corporation was presented with the CIRCUITS ASSEMBLY New Product Introduction (NPI) Award for its Core 230-RC flux-cored wire at the IPC APEX EXPO technical conference. The NPI Awards recognize the leading new products for electronics assembly during the past year. Honorees are selected by an independent panel of practicing engineers. February 2018.
ISO/TS 16949 Management System Certificates
Indium Corporation earned ISO/TS 16949 management system certificates for two of its manufacturing facilities and company headquarters. January 2018.
CNY BEST Award for Individual/Team: (Rick Short and Jim McCoy)
Rick Short, Corporate Associate Vice President and Senior Director of Marketing Communications, and Jim McCoy, Talent Acquisition Supervisor, earned the CNY BEST Award for Individual/Team by the CNY chapter of the Association for Talent Development (ATD). They were recognized for their passion, foresight, and continued participation in making the Oneida-Herkimer-Madison BOCES (OHM BOCES) Pathways in Technology Early College High School (P-TECH) program a success. November 2017.
CIRCUITS ASSEMBLY Service Excellence Award for Materials
Indium Corporation was presented with the CIRCUITS ASSEMBLY Service Excellence Award for Materials during the IPC APEX EXPO technical conference San Diego, California. The Service Excellence Awards recognize electronics manufacturing companies that, as judged by their own customers, demonstrate the highest performance across the areas of technology, responsiveness, dependability, quality, and value for price. February 2017.
Business Leadership Award
Indium Corporation was presented with the Business Leadership Award at the New York Association of Training & Employment Professional's (NYATEP) 2016 Statewide Workforce Awards Ceremony on Oct. 26 in Albany, NY, for its outstanding workforce development advocacy demonstrated through its intern program leadership. October 2016.
Global Technology Award for Solder Paste: (Indium10.1HF)
Indium Corporation was presented with the Global Technology Award for Solder Paste for Indium10.1HF Solder Paste at SMTA International (SMTAI) Conference in Rosemont, Ill. This award has acknowledged outstanding innovations in the printed circuit board assembly and packaging industry. This is the fourth consecutive year that Indium has won this award. October 2016.
ON Semiconductor Award for “Perfect Quality”
Indium Corporation was presented with the ON Semiconductor Award for “Perfect Quality” in 2015. This award is the recognition for Indium’s product and service. June 2016.
Global Technology Award for Best Products – Americas: (InFORMS™)
Indium Corporation was presented with the Global Technology Award for Best Products – Americas for InFORMS® high-reliability solder preforms, on Nov. 10 at Productronica in Munich, Germany. This award has acknowledged outstanding innovations in the printed circuit board assembly and packaging industry for the past 10 years. November 2015.
Global Technology Award: (BiAgX®)
Global SMT & Packaging magazine’s Global Technology Award in the Solder Paste category for BiAgX® Solder Paste Technology. The award acknowledges outstanding innovations in the printed circuit board assembly and packaging industry. This is the second consecutive year that Indium Corporation has won the Solder Paste award. September 2015.
SMT China Vision Award: (Indium10.1HF)
Indium Corporation was presented with the SMT China Vision Award for its Indium10.1 solder paste at NEPCON China on April 21 in Shanghai, China. The SMT China Vision Award recognizes domestic and international companies with innovative products and technologies in SMT methods, processes, materials, equipment, software, and management services. Each product entry was evaluated based on its creativeness, technological advancement, and contributions to help reduce cost, improve quality, increase efficiency, enhance reliability, ensure safety, and protect the environment. May 2015.
Businessman Award by Cheongjy City: (Greg Evans)
Greg Evans, President and CEO, was awarded with the Businessman Award by Cheongjy City for the outstanding performance of Indium Corporation’s Korean facility and its contribution to the Cheongju City economy. March 2015.
CIRCUITS ASSEMBLY's NPI Award : (LV1000)
Indium Corporation’s LV1000 flux coating for solder preforms was presented with CIRCUITS ASSEMBLY's NPI Award at the IPC APEX Expo on Feb. 24 in San Diego, California. It recognizes the electronics assembly industry's leading new products. February 2015.
Top 10 List of SMT Tech Tuesday : (Ed Briggs)
Ed Briggs’s Meeting Future Stencil Printing Challenges with Ultrafine Powder Solder Pastes has made the top 10 list of SMT Tech Tuesday articles for 2014 by SMTOnline, one of the PCBA industry's most respected publications. This is the third consecutive year that an Indium Corporation authored paper has been named to this list. January 2015.
2014 William D. Ashman Award: (Andy C. Mackie, PhD, MSc)
Indium Corporation’s Andy C. Mackie, PhD, MSc, senior product manager for semiconductor and advanced assembly materials, was presented with the 2014 William D. Ashman Award at the 47th International Symposium on Microelectronics on Oct. 14, 2014, in San Diego, Calif. October 2014
Global Technology Award: (SACm™)
Global SMT & Packaging's Global Technology Award for SACm™ solder alloy. This award recognizes, "outstanding innovations in the printed circuit board assembly and packaging industry". November 2013.
Innova Award: (Heat-Spring®)
LED Journal's "Innova Award", for Heat-Spring® thermal interface material. This award recognizes, "leading companies within the LED market which have shown, through their products and services, the most innovative and advanced technology breakthroughs in LEDs." May 2010.
