The different flux and solder paste formulations mean that some products will have different material lifetimes than others. Understanding the lifetim...
I will be presenting this coming February at SMTA PanPac. Here are several reasons why you should come to this show....
Since pure indium preforms are so soft, making thousands of parts requires different processing and packaging methods than manufacturing jus...
New Durafuse™ LT is a novel mixed alloy system designed to combine low temperature reflow with drop-shock performance similar to or better ...
Part 3 of the semiconductor flux series talks about the important cleaning function of fluxes and how thermocompression bonding can help prevent warpa...
When looking at the reliability of AuSn solder paste, you need to take a couple of things into consideration, the post reflow alloy composition (off-e...
Today's electronics continue to get smaller and smaller, so the traditional type 3 (-200/+325) mesh size might be too large for new scale-ups. Thi...
This is the second in a series of posts about semiconductor fluxes, and talks about the optimal dipping depth for flip-chip fluxes....
If you are a little intimidated by semiconductor products, this blog post provides a simple explanation to help you better understand these products....
Copper smelting was critically important to the development of civilization - and it was a miracle it ever began. Perhaps the beauty of this ore led i...
This coming February will be my third SMTA PanPac. PanPac is a very enjoyable and rewarding conference with a full venue. Costs are reasonable as well...
