Come Visit Our Brand New Website
Have you had a chance to look at the new Indium Corporation web site? It has a brand new format and some new features that we think you will lik...
Engineering Drawing / Specifications for Pure Indium Preforms
Missing dimensions can be resolved, but checking for this before sending the drawing can eliminate the time needed to solve the issue. Thorough drawin...
Reflecting on my Internship
With the summer internship season approaching, I can’t help but reflect back to the days when I was an intern for Indium Corporation....
How SEM Analysis can be used to Characterize a Solder Joint
Backscattered Electrons and Secondary Electrons are used as two different detection methods in a Scanning Electron Microscope (SEM). Each detecion met...
Starvation Voids: When too little (paste) becomes too much (voiding)
Diving deeper into exploring the types of voids and how they occur, some important interactions between material and process variables appear....
Why Do We Need to Go Thinner?
Indium Corporation has developed a thinner gold preform for high-output lasers, therefore improving the thermal transfer and operational efficiency of...
Why QuickSinter®? Let’s see the difference between Soldering and Sintering
Dr. McDonough discusses some of the benefits of QuickSinter® including its ability to handle high-temperature operating life without breaking...
Selecting the Right Packaging for Pure Indium Preforms
Indium metal preforms need specialized packaging to ensure they arrive at your facility safetly and securely. Let us help you choose just the right pa...
Statistically Significant versus Practically Significant in SMT Data Collection
When comparing data with a large sample size, you may find that although the data shows that one sample is STATISTICALLY significantly better, it may ...
Solder Fortification Preforms Revisited
Using Solder Fortification preforms to fix starvation voids caused by plated vias in the ground pad design....
