SPIE Photonics West 2022

Indium Corporation to promote new specialty prodict offerings: AuLTRA™75, AuLTRA™ ThInFORMS™, and AuLTRA™ Fine Ribbo...

Posted On: January 16th, 2022 | By: Dr. Ron Lasky

Join Me at SMTA's PanPac 2022 - January 31 to February 3

Folks, I will be presenting three papers at PanPac 2022. They are: 1. Low Melt High Remelt Solder Paste, co-authored with Claire Hotvedt of Indium Cor...

Posted On: January 12th, 2022 | By: Dr. Ron Lasky

Using FMEA to Determine Your Tin Whisker Mitigration Strategy

Folks, In our last post, we discussed techniques to mitigate tin whiskers. To help determine what your tin whisker mitigation strategy should be, cons...

Posted On: December 18th, 2021 | By: Dr. Ron Lasky

Tin Whiskers IV: Mitigation

Folks, In the last post on tin whiskers, we discussed detection. In this post, we will cover mitigation. Since compressive stresses are a primary caus...

Posted On: December 4th, 2021 | By: Dr. Ron Lasky

Tin Whiskers 101: Part III: Detection

Folks, One of the great challenges of tin whiskers is detecting them. When one considers that their median thickness is in the 3 to 5 micron range (a...

Posted On: November 29th, 2021 | By: Jenny Gallery

Back to Basics: Au-Based Alloys

Indium's “Gold Standard” refers to the overall reliability and quality you can expect from our gold-based solder materials. Gold-based...

Posted On: November 24th, 2021 | By: Dr. Ron Lasky

SMTAI: A Big Success

Folks, I just can back from SMTAI in Minneapolis a few weeks ago. To me it was a big success. One of the reasons being that attendance was higher than...

Posted On: October 31st, 2021 | By: Dr. Ron Lasky

Tin Whiskers 101: Part 2: What Causes Them

Folks, Continuing our series on tin whiskers. In the last post we discussed what they are. in this post we will discuss what causes them. Tin whiske...