Using ANOVA to Compare Three or More Solder Pastes for a Metric-Like Transfer Efficiency

An Interview with Professor Patty Coleman....

Posted On: October 3rd, 2023 | By: Dr. Ron Lasky

Stencil Printing Response to Pause

Folks, Good friends Phil Zarrow and Jim Hall did an episode on their world famous “podcast” “Boardtalk” on the importance of r...

Posted On: August 31st, 2023 | By: Dr. Ron Lasky

Join Me at SMTAI 2023

Folks, This year SMTAI is in Minneapolis from October 9 to October 12. I will be giving a paper on hotbar soldering in the morning on Thursday October...

Posted On: August 6th, 2023 | By: Dr. Ron Lasky

Spreadsheet to Turn Solder Wire Mass to Length and Vice Versa

Folks, Digikey colleague Aaron Rollens developed the equation to convert the mass on a spool of solder wire into its length. I also developed the equa...

Posted On: July 30th, 2023 | By: Dr. Ron Lasky

Technique to Estimate the Upper Confidence Limit on Failure Rates

Folks, Let’s assume you would like to estimate the upper confidence limit of a failure rate. As an example, assume you have 21 samples of 1000 t...

Posted On: July 22nd, 2023 | By: Dr. Ron Lasky

Acceleration Factors in Life Testing of Electronics

Folks, You are the project manager for a PCB that must function in an environment from -10 to 80 C. The PCB will experience one thermal cycle per day ...

Posted On: July 6th, 2023 | By: Dr. Ron Lasky

Excel Spreadsheet to Calculate and Graph Intermetallic Growth in Solder Joints

Folks, In my last post, I discussed the concern for copper-tin intermetallic (IMC) growth in solder joints at high service temperatures. Since then, I...

Posted On: July 3rd, 2023 | By: Thuy Nguyen

Breakdown of SIR Standards

SIR Testing-Surface and Insulation Resistance testing, a form of standard testing where you measure the electrical reliability of a no-clean or a...

Posted On: June 30th, 2023 | By: Robert McKerrow

A Proper Solder Introduction Point in Hand or Robotic Soldering Can Solve Many Common Issues

The introduction point between the pad and the soldeirng iron tip plays a crucial role in creating perfect solder joints, as well as gives clues as to...

Posted On: June 27th, 2023 | By: Dr. Ron Lasky

Concern for Intermetallic Thickness Growth in SAC Solder Joints in Harsh Service Environments

Folks, The service temperature for electronics in a modern automobile can be higher than 125C. These high temperatures raise the concern of copper-tin...