MEMS Assembly

MEMS Assembly

    • Dispense consistently
    • Reduce blow holes and solder creep
    • Suitable for all high-melting alloys (220-255ºC)
    • No-intentionally-added halogens [halogen-free flux]
    MEMS Assembly

    Indium8.9HF Solder Paste

    • Standard colorless residue
    • Airless syringe packaging
    • Complete wetting reduces blow holes
    • Long dispense life

    NC-SMQ®77 Solder Paste

    • Ultra-low residue
    • Does not contaminate MEMS surfaces with flux spatter
    • Airless syringe packaging
    • Proven in high volume manufacturing (HVM)

    Indalloy® Chart

    Indalloy®
    Number
    Liquidus
    °C
    Solidus
    °C
    Elemental Composition
    (% by Mass)
    121 221 Eutectic 96.5Sn/3.5Ag
    267 224 221 97.0Sn/3.0Ag
    123 226 221 97.5Sn/2.5Ag
    243 227 Eutectic 99.0Sn/1.0Cu
    244 227 Eutectic 99.3Sn/0.7Cu
    262 (Sn995) 227 Eutectic 99.5Sn/0.5Cu
    129 234 232 99.0Sn/1.0Sb
    131 237 235 97.0Sn/3.0Sb
    132 240 221 95.0Sn/5.0Ag
    133 240 237 95.0Sn/5.0Sb
    264 248 241 91.5Sn/8.5Sb
    259 257 243 90.0Sn/10.0Sb
    143 260 252 90.0Pb/10.0Sb
    SMT-BiAgX® 262 285 Proprietary
    10 267 235 75.0Pb/25.0In
    150 275 260 81.0Pb/19.0In
    182 280 Eutectic 80.0Au/20.0Sn