TIM1, TIM1.5, and TIM2

Metal-based thermal interface material (TIM) solutions provide superior thermal performance and long-term reliability across multiple layers of the thermal stack. Whether using air cooling, direct liquid cooling, or immersion cooling, these TIMs can be tailored to meet specific thermal demands. Their ability to wet to a wide range of surfaces, combined with high isotropic thermal conductivity and low yield and flow strengths, allows them to conform to surface irregularities, effectively reducing overall thermal resistance (Rth).

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Illustration of a microchip with a transparent layer hovering above, showcasing internal electronic components in precise detail, reminiscent of the intricate design in the tim1 40 series.

Overview

Specializing in Metal-Based TIMs with Thermal, Reliability, and Conformance Advantages

Indium Corporation leads the way in developing novel TIMs and processes for TIM1, TIM1.5, and TIM2 applications.

TIM1

Green circuit board with solder balls underneath and a gray heat spreader and metal lid over a dark.

Solders and liquid metals are used as high-performance TIMs between a semiconductor die and a package lid. Reflow and non-reflow solutions are available for LGA, PGA and BGA packages that see single or multiple reflow cycles.

TIM1.5

Exploded view of a green circuit board with solder balls, a blue-edged chip, and a finned heat sink.

High-performance computing (HPC) applications require best-in-class TIM materials and process expertise. TIM1.5 (bare die lidless BGA packages) is the interface between a bare die and a heat-sink or cold plate and is often used in HPC design. Indium Corporation can help you choose between soldered, compressible, or liquid metal-based TIMs.