애플리케이션 열 관리 팀1, 팀1.5, 팀2

TIM1, TIM1.5 및 TIM2

Metal-based thermal interface material (TIM) solutions provide superior thermal performance and long-term reliability across multiple layers of the thermal stack. Whether using air cooling, direct liquid cooling, or immersion cooling, these TIMs can be tailored to meet specific thermal demands. Their ability to wet to a wide range of surfaces, combined with high isotropic thermal conductivity and low yield and flow strengths, allows them to conform to surface irregularities, effectively reducing overall thermal resistance (Rth).

열, 신뢰성 및 적합성 이점을 갖춘 금속 기반 TIM 전문 기업

Indium Corporation leads the way in developing novel TIMs and processes for TIM1, TIM1.5, and TIM2 applications.

TIM1

Solders and liquid metals are used as high-performance TIMs between a semiconductor die and a package lid. Reflow and non-reflow solutions are available for LGA, PGA and BGA packages that see single or multiple reflow cycles.

TIM1.5

High-performance computing (HPC) applications require best-in-class TIM materials and process expertise. TIM1.5 (bare die lidless BGA packages) is the interface between a bare die and a heat-sink or cold plate and is often used in HPC design. Indium Corporation can help you choose between soldered, compressible, or liquid metal-based TIMs.

TIM2

TIM2 is the interface between a heat spreader or lid and a heat-sink. We typically recommend compressible TIMs, such as Heat-Spring®.

관련 애플리케이션

격자형 구조와 반사 광택이 있는 다채로운 패턴의 마이크로칩 표면을 클로즈업합니다.

반도체 패키징 및 조립

Critical semiconductor packaging ensures functionality and durability.

회로 기판 위에 놓인 열 패드가 겹겹이 쌓인 마이크로칩의 클로즈업.

침수 냉각

A technique on the rise for thermal…

SiP 및 이기종 통합 어셈블리(HIA)

SiP and Heterogeneous Integration Assembly (HIA)

시스템 인 패키지(SiP) 및 이기종 통합 솔루션

전자 부품과 패턴이 보이는 녹색 회로 기판 위에 있는 컴퓨터 마이크로칩을 클로즈업합니다.

열 관리

Thermal solutions for HPC ensuring reliability and…

Futuristic white car with advanced power electronics zips through a neon-lit city at night, showcasing cutting-edge speed and technology.

전력 전자 패키징 및 조립

Extensive range of proven high-reliability solder and…

관련 시장