보도 자료

CLINTON, N.Y., July 2, 2026 — Indium Corporation® Senior Applications Development Engineer, Engineered Solder Materials (ESM), Ryan Mayberry will present research on the use of thermal interface

CLINTON, N.Y., June 3, 2026 — Indium Corporation® and Ames National Laboratory have announced a research and development partnership to expand U.S. production of gallium, a critical material used

CLINTON, N.Y., June 1, 2026 — Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how advanced metal thermal interface materials (TIMs) can achieve new performance thresholds in

2026년 5월 29일, 뉴욕주 클린턴 – 중요한 RF/마이크로파 응용 분야를 위한 혁신적인 소재 솔루션 분야의 업계 선두주자인 인듐 코퍼레이션®(Indium Corporation®)은 고신뢰성의 금 기반

뉴욕주 클린턴, 2026년 5월 xx일 – 모든 전력 전자 장치용 고신뢰성 소재 분야의 선도적인 공급업체인 인듐 코퍼레이션®(Indium Corporation®)은 PCIM에서 AI 적용이 가능한 자사의 제품 포트폴리오를 선보일 예정입니다.

CLINTON, N.Y., May 26, 2026 — Indium Corporation®, a leading provider of high-reliability soldering, sintering, and thermal interface materials for power electronics devices, will feature three

2026년 5월 21일, 뉴욕주 클린턴 – 반도체 패키징 및 조립 분야 혁신적인 소재 솔루션의 업계 선두주자인 인듐 코퍼레이션®(Indium Corporation®)은 자사의 고신뢰성 제품군을 선보일 예정입니다.

CLINTON, N.Y., May 15, 2026 — Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how metal thermal interface materials (TIMs) can unlock the full performance potential of

CLINTON, N.Y., May 13, 2026 — Indium Corporation® Applications Development Engineer, Engineered Solder Materials (ESM), Kyle Aserian, will present research on the use of indium-based solder

CLINTON, N.Y., May 12, 2026 — As a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge

CLINTON, N.Y., May 1, 2026 — As a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product

CLINTON, N.Y., April 30, 2026 — As a leading provider of advanced materials solutions enabling today’s demanding AI applications, Indium Corporation® experts will share their technical

2026년 4월 27일, 뉴욕주 클린턴 — 인듐 코퍼레이션(Indium Corporation)은 오늘 으로부터 320만 달러의 보조금을 수령했다고 발표했습니다.

2026년 4월 23일, 뉴욕주 클린턴 — 인듐 코퍼레이션®(Indium Corporation®)은 오늘, 다음을 지원하는 국가 차원의 이니셔티브인 인도 디자인·반도체·패키징·시스템(IDSPS) 프로그램에 참여했다고 발표했습니다.

CLINTON, N.Y., April 14, 2026 — Indium Corporation® Senior Global Product Manager, Semiconductor and Advanced Materials, Sze Pei Lim will present a collaborative International Electronics

CLINTON, N.Y., April 6, 2026 — Indium Corporation®, a leading materials provider for the electronics assembly market, recently received Electronics Manufacturing (EM) Asia Innovation Awards for

CLINTON, N.Y., April 3, 2026 — Indium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and electronics assembly, announced that it has executed a

CLINTON, N.Y., March 31, 2026 – As a leading materials provider to the electric vehicle (EV) and e-mobility industries—addressing power module- and PCBA-level applications—Indium Corporation®

CLINTON, N.Y., March 23, 2026 — Indium Corporation® received a Circuits Assembly New Product Introduction (NPI) Award for Indium12.9HF, a halogen-free solder paste engineered for cost-effective,

CLINTON, N.Y., March 19, 2026 — As a proven leader in soldering materials and metal thermal interface materials (TIMs) solutions for future-forward technologies, Indium Corporation® will showcase

CLINTON, N.Y., March 19, 2026 — Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how innovative interconnect materials can drive higher yields and reliability in semiconductor