Comunicati stampa

CLINTON, N.Y., 3 giugno 2026 — Indium Corporation® e l’Ames National Laboratory hanno annunciato una partnership nel campo della ricerca e dello sviluppo volta ad ampliare la produzione statunitense di gallio, un materiale fondamentale utilizzato

CLINTON, N.Y., 1° giugno 2026 — Leo Hu, Senior Area Technical Manager di Indium Corporation®, illustrerà come i materiali termoconduttivi metallici avanzati (TIM) possano raggiungere nuovi livelli prestazionali in

CLINTON, N.Y., 29 maggio 2026 – In qualità di leader del settore nelle soluzioni innovative basate sui materiali per applicazioni critiche in ambito RF/microonde, Indium Corporation® presenterà la sua linea di prodotti ad alta affidabilità a base di oro

CLINTON, N.Y., May xx, 2026 – As a leading provider of high-reliability materials for all power electronics devices, Indium Corporation® will showcase its AI-enabling portfolio of products at PCIM

CLINTON, N.Y., 22 maggio 2026 — Indium Corporation® ha ricevuto un premio per la sostenibilità da ASE Technology Holding Co., Ltd. (ASE) in occasione della recente cerimonia di premiazione dei migliori fornitori del 2025 tenutasi a Taichung,

CLINTON, N.Y., 26 maggio 2026 — Indium Corporation®, fornitore leader di materiali ad alta affidabilità per la saldatura, la sinterizzazione e l’interfaccia termica destinati ai dispositivi di elettronica di potenza, presenterà tre

CLINTON, N.Y., 21 maggio 2026 – In qualità di leader del settore nelle soluzioni innovative in materia di materiali per il confezionamento e l’assemblaggio di semiconduttori, Indium Corporation® presenterà la propria gamma di prodotti ad alta affidabilità

CLINTON, N.Y., May 15, 2026 — Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how metal thermal interface materials (TIMs) can unlock the full performance potential of

CLINTON, N.Y., May 13, 2026 — Indium Corporation® Applications Development Engineer, Engineered Solder Materials (ESM), Kyle Aserian, will present research on the use of indium-based solder

CLINTON, N.Y., May 12, 2026 — As a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge

CLINTON, N.Y., May 1, 2026 — As a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product

CLINTON, N.Y., April 30, 2026 — As a leading provider of advanced materials solutions enabling today’s demanding AI applications, Indium Corporation® experts will share their technical

CLINTON, N.Y., April 27, 2026 — Indium Corporation today announced it has been awarded a $3.2 million grant by the

CLINTON, N.Y., April 23, 2026 — Indium Corporation® today announced that it has joined the Indian Design, Semiconductor, Packaging and Systems (IDSPS) program, a national initiative supporting

CLINTON, N.Y., April 14, 2026 — Indium Corporation® Senior Global Product Manager, Semiconductor and Advanced Materials, Sze Pei Lim will present a collaborative International Electronics

CLINTON, N.Y., April 6, 2026 — Indium Corporation®, a leading materials provider for the electronics assembly market, recently received Electronics Manufacturing (EM) Asia Innovation Awards for

CLINTON, N.Y., April 3, 2026 — Indium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and electronics assembly, announced that it has executed a

CLINTON, N.Y., March 31, 2026 – As a leading materials provider to the electric vehicle (EV) and e-mobility industries—addressing power module- and PCBA-level applications—Indium Corporation®

CLINTON, N.Y., March 23, 2026 — Indium Corporation® received a Circuits Assembly New Product Introduction (NPI) Award for Indium12.9HF, a halogen-free solder paste engineered for cost-effective,

CLINTON, N.Y., March 19, 2026 — As a proven leader in soldering materials and metal thermal interface materials (TIMs) solutions for future-forward technologies, Indium Corporation® will showcase

CLINTON, N.Y., March 19, 2026 — Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how innovative interconnect materials can drive higher yields and reliability in semiconductor