新聞稿

CLINTON, N.Y., April 14, 2026 — Indium Corporation® Senior Global Product Manager, Semiconductor and Advanced Materials, Sze Pei Lim will present a collaborative International Electronics

CLINTON, N.Y., April 6, 2026 — Indium Corporation®, a leading materials provider for the electronics assembly market, recently received Electronics Manufacturing (EM) Asia Innovation Awards for

CLINTON, N.Y., April 3, 2026 — Indium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and electronics assembly, announced that it has executed a

CLINTON, N.Y., March 31, 2026 – As a leading materials provider to the electric vehicle (EV) and e-mobility industries—addressing power module- and PCBA-level applications—Indium Corporation®

CLINTON, N.Y., March 23, 2026 — Indium Corporation® received a Circuits Assembly New Product Introduction (NPI) Award for Indium12.9HF, a halogen-free solder paste engineered for cost-effective,

CLINTON, N.Y., March 19, 2026 — As a proven leader in soldering materials and metal thermal interface materials (TIMs) solutions for future-forward technologies, Indium Corporation® will showcase

CLINTON, N.Y., March 19, 2026 — Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how innovative interconnect materials can drive higher yields and reliability in semiconductor

CLINTON, N.Y., March 18, 2026 — Indium Corporation® Product Manager – Semiconductor Dean Payne will present copper sinter paste solutions that deliver high thermal and reliability performance,

CLINTON, N.Y., March 18, 2026 — As a leading provider of advanced materials solutions for power device packaging, Indium Corporation® will feature its lineup of high-reliability products

CLINTON, N.Y., March 12, 2026 — Indium Corporation® will showcase its proven solder solutions through live demonstrations at APEX Expo 2026,  March 17-19, in

CLINTON, N.Y., March 11, 2026 — As a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge

CLINTON, N.Y., March 3, 2026 — Indium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at APEX EXPO 2026, March

CLINTON, N.Y., February 27, 2026 — Indium Corporation® will highlight high-reliability liquid metal technology and metal thermal interface material (TIM) products at SEMI-THERM 2026, March 9-12,

With Advanced Materials Solutions at CIPS 2026 CLINTON, N.Y., February 26, 2026 — As a leading provider of advanced materials solutions for power device packaging, Indium Corporation® will

CLINTON, N.Y., February 25, 2026 — Indium Corporation® Product Manager, Engineered Solder Materials (ESM), Jim McCoy, will present techniques to minimize oxidation and improve the thermal

CLINTON, N.Y., February 19, 2026 — As one of the leading providers of high-performance thermal management solutions, Indium Corporation® will feature its lineup of metal thermal interface

CLINTON, N.Y., February 17, 2026 — Indium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation at TestConX 2026, taking place March 1-4 in Mesa,

紐約州克林頓市，2026年1月21日 — 英德姆公司®將於2月3日至5日在加州安納罕舉行的MD&M West展會上，展示其高可靠性AuLTRA® MediPro金焊料解決方案。AuLTRA®

紐約州克林頓市，2026年1月15日 — 銦泰公司專家將於NEPCON Japan 2026展會發表關於焊接製程與燒結材料選用的專題演講。本屆為該會議四十週年紀念大會，

紐約州克林頓市，2026年1月14日 — Indium Corporation®將於2026年1月21日至23日舉行的NEPCON Japan 2026展會上，重點展示其高度多功能的InFORCE®系列壓力燒結膏。

CLINTON, N.Y., January 14, 2026 — Indium Corporation® will feature its formic acid soldering technologies (FAST) product series at NEPCON Japan 2026, taking place January 21-23, in Tokyo. The