PCB 返修

使用熱耦合器 (TC) 進行回流焊剖面分析，可以避免色譜法 (IC) 和應變儀 (SG) 測試。

The tremendous increase in the use of bottom terminated components (BTCs), some estimates are at more than 50 billion per year, have heightened the concern for minimizing voiding between the thermal

Folks, Let’s see how Patty is doing, it’s been a very, very long time… Even though Patty and her husband Rob both worked at Ivy University, they seldom drove in together. It was

各位，請同情約公元前 3500 年的冰人 Ötzi。據說他曾參與銅冶煉，因為在他的身上發現了銅粒和砷，砷是某些銅礦石的微量元素。

Often times solder defects such as spattering, voiding, slumping/bridging, and tombstoning can be remedied just by adjusting the reflow profile. For this reason it is important to understand the

In my previous post on this topic, Stages of a Reflow Profile: Part II, I mentioned a few profile-induced soldering defects, including graping, tombstoning, and voiding. In this post,we will talk

Happy New Year everyone! Typically the new year signals a new beginning, but thispost will be concluding our series on reflow profilingby discussing the fourth stage of a reflow profile: the

Folks, Six months ago……. Patty had just finished an all day workshop on “Common Defects in SMT Assembly and How to Minimize Them." The workshop seemed to go really well, and

Folks, Patty really liked living in Woodstock, Vermont. She enjoyed the wildlife that literally came up to her kitchen