應用
甲酸回流焊接
Formic acid is a carboxylic acid with the chemical formula HCOOH. When heated to temperatures ≥ 180oC, formic acid “activates” to become a very efficient reducing agent of metal oxides. When formic acid is utilized in reflow soldering, a flux is no longer necessary. Formic acid reflow with the addition of vacuum ensures a true no-clean process with ultra-low voiding and reduced environmental impact compared to traditional reflow soldering thanks to the removal of the cleaning step and the associated waste produced.
概述
使用無助熔劑材料進行甲酸回流的革新
Formic acid soldering is a cutting-edge technology within the power electronics assembly space, that enables the creation of clean, low-void solder joints without the use of a traditional flux. Indium Corporation is at the forefront of developing high purity, flux-free solders specifically for the formic acid soldering application. The FAST (Formic Acid Soldering Technology) family of products include preforms, InTACK® tacking agent and the novel flux-less FAST Paste.
優點
用於關鍵應用的創新材料
幾乎零殘留
回流之後，幾乎所有的材料都會被蒸發掉，只留下乾淨的焊點。
無須清潔
降低化學成本和減少製程步驟有助於實現可持續發展目標。
增強相容性
沒有殘留物，也就不存在助焊劑殘留物與底材或成型材料相容性的問題。
消除電化學遷移
只使用可完全蒸發的良性化學品，消除了 ECM 的風險。
Reflow Soldering with Formic Acid Products
粘接劑
Tacking agent to reduce fixturing needs and…
半導體焊膏
Proven diverse range of semiconductor solder pastes.
強化預型件
InFORMS® reinforced solder preforms enhance joint reliability…
蟻酸焊接技術（FAST）
一項獲得專利的焊料合金技術，可實現……
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