半導體封裝與組裝

Achieving efficiency, reliability, and exceptional thermal performance is crucial in package-attach soldering applications for power modules. However, the high reflow temperatures required by

A little over a year ago, I posted about the increase in interest regarding Cu sintering. In the past 12 months, that interest has has surged, highlighting Cu sintering's suitability for various

During my first few weeks as a Technical Support Engineer at Indium Corporation, Iresearched extensively and consulted with my team to find out when flux should be used and why it’s essential

Folks, I am working on a book with my Indium Corporation colleagues on tackling soldering defects in electronics.It is a follow up to our The Printed Circuits Assembler's Guide to Solder Defects.

在今天這個快節奏的世界，永續發展和環境責任是最重要的，Indium Corporation 正以創新的資源管理方式引領潮流。我們的

各位，在今天的部落格中，我們將訪問 Pamela Nelson。她是 Indium Corporation 的封裝產品專家。Indium Corporation 的產品專員 Pamela Nelson。

InFORMS® 概觀 在電子製造領域，特別是在電源模組和電動汽車變流器等高壓力應用中，確保可靠性和耐用性是非常重要的。

各位，Peter 來信：Dear Dr. Ron, I amthrilled with your Excel® program to calculate IMC thickness as a function of time.但是，我想要計算未列於下列時間的 IMC 厚度。

各位，我有點小屋熱，所以我想去 Simon Pearce 吃午餐。那裡的氛圍總能讓我放輕鬆、精神一振。所以，餐廳老闆把我安排在一個小桌子上。