概述
Indium Corporation 可靠的解決方案為熱棒焊接帶來革命性的改變
熱棒焊接是將柔性電路連接到脊狀電路板的一種日益流行的方法。 Indium Corporation 的 Durafuse® LT 是最先進的專利焊膏合金系統,與傳統 SAC305 焊膏或各向異性導電薄膜 (ACF) 材料相比,可實現更低溫的熱棒回流焊製程,產生更堅固、更可靠的焊點,並提高可持續性。
優點
開啟具成本效益、可靠且簡化的焊錫解決方案
效率與成本效益
Indium Corporation 的解決方案可縮短製程時間,並將對額外元件的需求降至最低,大幅降低成本。
強化熱能管理
我們的焊料具有優異的熱傳導性,這對於在高溫作業中維持焊點的完整性至關重要。
提高可靠性
即使在嚴苛的條件下,我們創新的焊劑和焊料組合也能提供一致的性能和耐用性。
簡化組裝
使用無助焊剂製程和精確的應用方法,可確保乾淨、堅固的連接,且殘留物最少。
熱棒焊接產品
Indium Corporation 的解決方案專為滿足熱棒焊接的獨特需求而量身打造,推動創新與效率。
相關應用程式
相關市場
熱條焊接在電信、消費性電子產品、汽車和工業設備等各種市場中都是不可或缺的。在製造軟性印刷電路 (FPC)、線束及其他要求高精度與高可靠性的元件時,其應用至關重要。
Back to the Basics: Flux
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