包裝上組裝

各位，讓我們來看看 Patty...... Patty 不得不承認，她開始感到厭煩了。有兩個工程系的女學生總是到她先生 Rob 的辦公室找她。

延續上次的討論……正如各位從先前關於這個主題的貼文中所記得的，我的朋友兼同事克里斯·納什（Chris Nash）和我當時正在討論一些關於低……的令人費解的結果

My friend and colleague Chris Nash and I were recently discussing some puzzling results for low dip height found during testing of package-on-package (PoP) materials. The findings will be of interest

This week a customer in Asia asked why one of our new epoxy fluxes was not allowing the package-on-package (PoP) device to be picked up from the dipping tray. Obviously, the vacuum nozzle must have

After you've reflowed solder in contact with a flux, you're always left with a certain amount of flux residue. There are no clear industry guidelines on how you refer to the residue, and new

Before even thinking of dipping a component, you had better verify that your paste or flux is 1) the proper thickness and 2) uniform across the surface of the flux reservoir. You can check this by

Package-on-Package solder paste is a relatively new concept in the solder industry. With limited material sets, we need to be able to capitalize on the flexibility of the few solder pastes that are

很多時候，人們認為浸漬過程很簡單。事實上......只要您事先花時間優化製程。

使用浸漬製程塗佈環氧助焊剂與使用傳統 PoP 助焊劑的浸漬製程類似，但助焊劑覆蓋元件凸點的情況除外。